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Tuesday, June 24, 2014

#3D: Hybrid Memory Cube Superchrages 3 teraFLOPS Intel Xeon Phi"

Hybrid Memory Cubes are 3-D stacks of DRAM that can supercharge a processor--here the 3 teraFLOPS Intel Xeon Phi--by surrounding it with fast-access memory almost without limits.


Micron's 2-gigabyte and 4-gigabyte parts will help customers increase channel bandwidth to 120 and 160 gigabytes per second, respectively. For Intel, Micron is customizing a 16-gigabyte part to supply channels optimized to the massively parallel processors on the next-generation Knights Landing Xeon Phi.


Micron has been working with Intel for several years to optimize the interface channels to maximize bandwidth to its processors. At the 2011 Intel Developers Conference, it demonstrated a single interface channel with a bandwidth of more than 1 terabit per second (seven times greater than DDR3). It also claimed the lowest-ever energy consumption of approximately 8 picoJoules per bit.

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