Tuesday, September 30, 2014

#SUPERCOMPUTERS: "Electronic Brain Promised by 2023"

The European Union is throwing $1.3 billion over 10-years at creating an electronic brain--they already have an Atlas of brain subsystems begun and 100 universities and corporations on-board building them: R. Colin Johnson @NextGenLog

Junction of four HICANNSs (High Input Count Analog Neural Networks) inside a reticle on a wafer containing many HICANN circuits.

Junction of four reticles on a post-processed HICANN (High Input Count Analog Neural Network) wafer within the BrainScaleS project and will be used as a neuromorphic physical model.
(Source: University of Heidelberg)

Junction of four reticles on a post-processed probe-card wafer used to verify the final post-processing method for power tests of the wafer module.

Further Reading

#MATERIALS: "IBM Grows Wafer Scale Grahene"

IBM has not only perfected a method of growing wafer scale graphene as a potential material for the post-silicon era, but has found a way to use it today to dramatically cut the cost of GaN LEDs.

A four-inch wafer of graphene successfully transferred to a silicon wafer.

Further Reading

Monday, September 29, 2014

#CHIPS: "Fairchild Reinvents Itself"

Fairchild aims to pioneer the 21st century by putting together smart modules that solve problems better for energy efficiency, mobility and the cloud.

As an example of Fairchild's modernization, it is now fabricating complete compact, high-efficiency, cost-effective modules aimed at driving up quality while driving down costs to its customers.

Further Reading

Friday, September 26, 2014

#ENERGY: "IBM/Airlight Beat Chinese PV with Higher Tech"

IBM and its collaborator AirLight believe they can beat the price of even the cheapest Chinese photovoltaic panels with a higher-tech disk based system that produces 12 kW of electricity and 20 kW of heat that can be used for HVC or desalinating water or both: R. Colin Johnson @ NextGenLog

This solar dish produced up to 20 KW thanks to a collaboration between Airlight Energy, which has perfected low-cost solar concentration to 2,000X, and IBM, which has perfected water-cooling chips down to 105 degrees that would otherwise be driven up to 1,500 degrees.


Wednesday, September 24, 2014

#MEMS: "Piezoelectric MEMS mics Seem Destined to Take Over"

Piezoelectric MEMS microphones have already chalked up 70 dB signal-to-noise rations (SNRs) and are on their way to 80 dB, which is virtually unattainable by the conventional capacitive MEMS mics that everybody else makes: R. Colin Johnson @ NextGenLog

Instead of a traditional round diaphragm like capacitive microphones use (right) piezoelectric microphones use a square block of piezoelectric material (aluminum nitride, green) divided into four triangles (along the X from corner to corner) which stretch and contract--but never touch--thus creating an ultra low-noise signal picked up by the metal (yellow and gold) electrodes.


Monday, September 22, 2014

#CHIPS: 10 Best Bets for Next Gen Memory"

Here are my best guess at the next-generation of memory storage technologies except for MRAM, 3D NAND, RRAM and Spin-Transfer Torque RAM (STT-RAM), which were left out for various reasons: R. Colin Johnson