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Tuesday, July 30, 2019

The Drive to #Quantum Computing


The U.S. National Quantum Initiative Act signed into law last December mandates a multi-billion-dollar, 10-year effort to build a quantum computer infrastructure, ecosystem, and workforce.
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Friday, July 12, 2019

#AI Chipping Away at Big Data

Hardware accelerators for artificial intelligence (AI) in end-user devices—neural network chips integrated into smartphones, autonomous vehicles, and Internet of Thing (IoT) devices—are capable of creating smaller representations of big data locally, rather than wasting bandwidth sending massive raw data streams to the cloud.
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Tuesday, June 04, 2019

#HACKERS: Preemptive Strike Beats Hackers at Their Own Game

At the International Conference on Cyber-Physical Systems (ICCPS 19) last month in Montreal, Canada, researchers turned the tables on drive-by-wire automobile hackers. Using covert channels to defeat hackers trying to take over the steering, brakes, and other critical parts of modern cars remotely, the researchers demonstrated the hackers' own methods can be used to authenticate each individual command given over the vehicle's control area network (CAN), eliminating the possibility of unauthorized interference with the car's operation.
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Thursday, April 18, 2019

#NEWS Even Bigger World's Largest Quantum Computer


The world's largest maker of quantum computers, Canada's D-Wave Systems Inc., recently announced the Pegasus generation of its quantum computers, featuring 2.5 times the qubits (more than 5,000) than its predecessor, as well as the elimination of a major stumbling block to commercialization by directly connecting each of those qubits to three times as many nearby qubits as its previous generation, the Chimera.

Thursday, April 04, 2019

#MEMS Hiding NEMS Devices Inside CMOS

Most micro-electro-mechanical systems (MEMS) inside your smartphone, smartwatch, or other wearable electronic device require a pair of silicon dice—one die for the MEMS moving parts, and one die for its complementary metal oxide semiconductor (CMOS) supporting electronics—requiring at least four cubic millimeters.

U.K.-based nanodevice startup Nanusens has developed a MEMS-inside-CMOS process, which yields a device that fits on a single cubic-millimeter chip-scale package (the same size as a chip's die).


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