U.K.-based nanodevice startup Nanusens has developed a MEMS-inside-CMOS process, which yields a device that fits on a single cubic-millimeter chip-scale package (the same size as a chip's die).
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Thursday, April 04, 2019
#MEMS Hiding NEMS Devices Inside CMOS
Most micro-electro-mechanical systems (MEMS) inside your smartphone, smartwatch, or other wearable electronic device require a pair of silicon dice—one die for the MEMS moving parts, and one die for its complementary metal oxide semiconductor (CMOS) supporting electronics—requiring at least four cubic millimeters.
U.K.-based nanodevice startup Nanusens has developed a MEMS-inside-CMOS process, which yields a device that fits on a single cubic-millimeter chip-scale package (the same size as a chip's die).
FULL TEXT
U.K.-based nanodevice startup Nanusens has developed a MEMS-inside-CMOS process, which yields a device that fits on a single cubic-millimeter chip-scale package (the same size as a chip's die).
FULL TEXT
