Showing posts sorted by date for query wireless:. Sort by relevance Show all posts
Showing posts sorted by date for query wireless:. Sort by relevance Show all posts
Friday, February 28, 2020
#NEWS Hacking Bluetooth
Bluetooth wirelessly connects (or pairs) Internet of Things (IoT) devices—usually wireless peripherals such as ear-buds, speakers, watches, health monitors and location beacons—with host wireless devices such as smartphones or tablets. The limited physical distance between hosts and peripherals, unfortunately, has resulted in their cybersecurity being lax, according to Carl Gunter, a professor in the computer science department of the University of Illinois at Urbana-Champaign.
FULL TEXT
Wednesday, May 17, 2017
Entries from 2017-2018
- Imec Aims 2-D FETs at Sub-5-nm Node | EE Times
- TI Claims to Obsolete FPGAs for Embedded Apps | EE Times
- NIST Backs Quantum-level Temperature Measurement | EE Times
- ReRAM Goes 3D | EE Times
- 'E-Brain' to Pilot Air Force Jets | EE Times
- Intel Banks on Artificial Intelligence | EE Times
- Cray Moves to Lasso 'Big Data Deluge' | EE Times
- Germanium Displacing GaAs for RF Transistors | EE Times
- 'Supercomputer-as-a-Service' Model is Born | EE Times
- IBM Optics Go CMOS | EE Times
- Researchers Print Stretchable Battery to Light Wearables | EE Times
- GaAs Nanowires Boost Solar | EE Times
- Is Elon Musk's Brain Cap Viable? | EE Times
- Cray Rolls Clustered Supercomputers for AI | EE Times
- Quantum Molecules Compute | EE Times
- Coventor Touts Unified MEMS Platform | EE Times
- 3-D Graphene Boosts Electronics | EE Times
- Researchers Create Artificial Synapse For Electronic Brains | EE Times
- Intel Re-defines Xeons | EE Times
- DoE Claims 1nm Fab Record | EE Times
- Single-Pixel Camera Mimics Human Eye | EE Times
- New Method Cuts Cost of GaAs Circuits | EE Times
- Smart Semi Fiber Does It All | EE Times
- Star Trek Tricorder Arrives | EE Times
- Quantum Photons Emitted | EE Times
- Researchers Developing Touch Sensitivity for Your Levi's | EE Times
- IBM Bests Insulators | EE Times
- ISPD Predicts Chip Futures | EE Times
- Intel Shows Life Beyond CMOS | EE Times
- TSMC Joins Chip Research Consortium | EE Times
- 3-D Interactive Projection Redefines MEMS | EE Times
- Peer-to-peer IBM App Bypasses Carriers | EE Times
- Atomic-scale Electronics Probed | EE Times
- Hydrogen Fuel Cells: DOE Finds Faster, Cheaper Catalyst | EE Times
- Samsung Beats Apple to Punch with MEMS Antenna Tuning Array | EE Times
- Space X: L.A. to S.F. in 35 Minutes | EE Times
- Bosch Dev Kit to Ease IoT | EE Times
- Quantum Computing on Cusp | EE Times
- Smartphone Senses Anything | EE Times
- Nanotube Contacts Perfected | EE Times
- Thinnest Nanowire Self-assembles | EE Times
- China Returns Navy Sea Drone | EE Times
- DARPA Funds Small Businesses with Big Ideas | EE Times
- Software Finds Research for You | EE Times
- Biometrics Won't Kill Passwords | EE Times
- Cray Sets Deep Learning Milestone | EE Times
- Biometrics Ensure Security | EE Times
- 1st Qubits on 300mm CMOS | EE Times
- Watson IDs Heart Disease | EE Times
- 1st Photonic Circuits Here | EE Times
- Photonics 3-D Modeler Born | EE Times
- Smartphone-Bound VR/AR to Be Boosted by Lasers | EE Times
- 3D Printed Buses Here | EE Times
- AT&T: SIMs are Key to IoT Future | EE Times
- Coating Stops Exploding Batteries | EE Times
- IEEE Sensor 2016 Exhibits MEMS | EE Times
- DARPA's N-Zero Sensors Use 0 Power | EE Times
- Watson Wins GM | EE Times
- Watson Use Proliferating | EE Times
- U.S. Protecting Us from AI | EE Times
- 4DS Memristors Target ReRAMs | EE Times
- Oxygen Layer May Extend Moore's Law | EE Times
- Nobel Prize: Why Superconductivity? | EE Times
- Software Predicts Power Component Failure | EE Times
- Biometrics May Replace Phone Passwords | EE Times
- Universal Memristor Models All | EE Times
- 5G Powered by MEMS | EE Times
- Transistor Trick Beats Moore | EE Times
- Biometrics Upgrade to AirPod-like Earbuds | EE Times
- SGI Supercomputes Ireland | EE Times
- IoT 3 in 1 Tape Measure Get Crowdfunding Love | EE Times
- Indoor Nav Leverages LTE | EE Times
- Ford / MIT Collaborate on Future | EE Times
- Advances Get a Grip on Single Photons & Molecules | EE Times
- Watson for the Masses | EE Times
- E-Retailers Automate Fulfillment | EE Times
- EPA Crowdsources Pollution Sensing | EE Times
- Intel to Acquire Deep Learning Nervana | EE Times
- IBM Lab on Chip Detects Cancer | EE Times
- 2-D PV to Rival Graphene | EE Times
- Next-Gen IoT Consortium Launches | EE Times
- Oxides Make Ultra Conductor | EE Times
- Spray-On Solar Material Holds Promise | EE Times
- Cray, Deloitte Don White Hat in Security Service | EE Times
- Stacking Boosts Polarimetry | EE Times
- Quantum Superconducting Advance | EE Times
- Intelligence Agency Sets 3D Challenge | EE Times
- IBM, Samsung Put New Spin on MRAM | EE Times
- Co-Robots Tend 3-D Printers | EE Times
- Intel Xeon Phi Solos | EE Times
- IBM to Donate Cognitive Analytics/Learning | EE Times
- DAC: Coventor Adds Electrical Analytics | EE Times
- Intel's Xeon Tackles Real Time | EE Times
- Russian Make Diamond MEMS Resonators | EE Times
- Intel Broadens Xeon Video Offerings | EE Times
- Ultra-Dense 3-D Packaging for IoT | EE Times
- NXP Aims to Target IoT | EE Times
- NXP Focuses on Smart Cities, Security in Keynote | EE Times
- IoT Security: Taming a Perfect Storm | EE Times
- Magnetic Graphene Possible | EE Times
- Diamond ICs May Finally Debut | EE Times
- Analog Brain to Simulate Real Thing | EE Times
- Graphene Patterned at Room Temp | EE Times
- MIT: Changing Coal into Circuitry | EE Times
- Harvest Electricity from Magnetism | EE Times
- Cutting Antenna Design Time | EE Times
- Russia, U.S. Get Closer to Universal Memory | EE Times
- Quantum Dots Boost Solar Cells | EE Times
- CMOS Circulator Chip Enables Single Antenna | EE Times
- Can Einstein Be Wrong About Naked Singularities? | EE Times
- Superconductor Nearing Room Temp | EE Times
- IBM Neurocomputer Detailed | EE Times
- Intel Plans A Future of CMOS | EE Times
- Intel's Xeon E5 in the Clouds | EE Times
- NeuroComputer to Shepherd Nukes | EE Times
- Ultrasonic LCDs Sans ITO | EE Times
- Top Robots for Farmers for 2016 | EE Times
- Concept of Superconducting Memory To Be Tested | EE Times
- Google Divesting Humanoid Robots | EE Times
- Last MEMS Oscillator Maker Standing | EE Times
- MEMS Grand Challenge Debuts | EE Times
- Leti Solves Silicon Resonator Mystery | EE Times
- Quantum Computers Crack Public-Key Encryption | EE Times
- Decoding Electronic Materials Genome | EE Times
- MRAM Breakthrough Looms | EE Times
- E.U. Tackles III-V on CMOS | EE Times
- Engineers Week Turns 65 | EE Times
- Watson XPrize Worth $5 Million | EE Times
- IBM CEO: Reinventing IBM's Profit Stream | EE Times
- IBM Claims Tamper-Resistant Server | EE Times
- DARPA to Remake Itself Leaner | EE Times
- Transistors Minus Semiconductors | EE Times
- Cavendish MEMS Displace SOI | EE Times
- Taiwan Pursues White LED | EE Times
- Robots Get A Gentler Grip | EE Times
- Russians' Report Memristors | EE Times
- Artificial Intelligence Pioneer Marvin Minsky Dead at 88 | EE Times
- Cardboard Energy Harvester | EE Times
- IoT Shoots for the Stars | EE Times
- Memristor Computer Emulates Brain Functions | EE Times
- Intel Thwarts Hackers | EE Times
- Little Pharm Born | EE Times
- Imec Melds Flash/III-V | EE Times
- Micron 3-D NAND Back to Moore | EE Times
- MediaTek 5G Combines Heterogenous Dark Silicon | EE Times
- CES: ASIC Enables Location Services | EE Times
- TSensors to Predict Natural Disasters | EE Times
- Intel Funds Doctor in Your Pocket | EE Times
- DARPA Funds Atoms-to-Products Breakthrough | EE Times
- Skin Cancer Biopsied by Optical Scan | EE Times
- Co-Robots: Taiwanese Style | EE Times
- Roadmap to Trillion Sensors Forks | EE Times
- One-Transistor SRAM Stuffs More Into CMOS | EE Times
- IBM Forecaster Cuts Pollution, Energy Waste | EE Times
- Tech & Climate: Stanford's Grand, Green Plan | EE Times
- Tech Tackles Climate Change: Wind & Will Power | EE Times
- 2016: Year of the Nanotube Transistor? | EE Times
- Technology Tackling Climate Change | EE Times
- MEMS Market: Ups and Upstarts | EE Times
- TrulySecure Embeds Biometrics | EE Times
- Menta eFPGAs Win Over E.U. | EE Times
- Intel Scales System Framework | EE Times
- Chinese Spending All-Out on HPCs | EE Times
- MEMS for Million-Dollar Horses | EE Times
- Write-Once Memory Speeds Up, Powers Down Reads | EE Times
- Micron Persistent Memory Pairs RAM/Flash | EE Times
- Oculus Originator Gives Away MEMS Version | EE Times
- Audio Digital Signal Processing Without the Experts | EE Times
- Slideshow: BMW's Hybrid EVs | EE Times
- IBM's Watson Tackles Sports | EE Times
- Mentor Graphics Speeds Ethernet Verification | EE Times
- Saxony Leads Germany's Semis | EE Times
- IBM Flash Downtime 30-Seconds per Year | EE Times
- Silicon on Insulator Penetrates Apple/Intel/IBM | EE Times
- Organics To Extend Moore's Law | EE Times
- 5G for Command & Control | EE Times
- Put FPGAs In Your SoCs | EE Times
- IBM Nanotubes May Redefine Future of Moore's Law | EE Times
- ASICs Memory Bandwidth Issue Fix Offered | EE Times
- 3D Memory Chips May Beat 3D Hybrid Memory Cube | EE Times
- Watson-Type Machine Learning Affordable for Small Business | EE Times
- MotionEngine Wear Debuts | EE Times
- Solar Cells Made Obsolete | EE Times
- VW's Woes Could be Solved by Tailpipe Add-on | EE Times
- 3-D Invisibility Guaranteed | EE Times
- Will Semiconductors Last Forever? | EE Times
- NIST Hits Quantum Teleport Key Out of the Park | EE Times
- 3D Printed Parts Help Regenerate Nerves | EE Times
- Google Unveils Project Aura | EE Times
- NASA Robots Proliferate | EE Times
- Glasses Foil Facial Recognition | News | Communications of the ACM
- Superconducting Graphene Beckons | EE Times
- Philips' Home Medicine Connects to Medical Records | EE Times
- Software Regulates Voltage in Everyday APUs | EE Times
- Smart Prosthetics to Learn Mind Reading | EE Times
- Post-Silicon Tech Compared | EE Times
- Green Gaming is Possible | EE Times
- IBM mbed with ARM | EE Times
- LED Displays Get Wearable | EE Times
- SiC/GaN Poised for Power | EE Times
- LEDs Get As Cheap as Bulbs | EE Times
- 'Future Frontier' Sees Drones, Space | EE Times
- Intel's Open-Source Fabric Supersizes Comm for Data | EE Times
- Fabless RF Filters Cut Size, Share Same Die | EE Times
- iPhone6 Powered by Hydrogen | EE Times
- Quantum Highway Frictionless | EE Times
- 5G the Free WiFi Killer | EE Times
- Plastic Solar Cells Double Output | EE Times
- Metamaterials Single-Out One Voice | EE Times
- Graphene Ribbons Grow on Germanium | EE Times
- RRAM Breaks Records with Graphene | EE Times
- IBM Watson Ready for Kick Off | EE Times
- 'Black Dart' Counters Drones | EE Times
- 3D Cursors Sculpt at Siggraph | EE Times
- Solar Cell, Battery Combo May Simplify Power Generation | EE Times
- Intel's Skylake Debuts at Gamecon | EE Times
- Semiconductor-less Transistors the Goal | EE Times
- Terahertz Optical Transistors Beat Silicon | EE Times
- NASA Preps Venus ICs | EE Times
- Hybrid Solar Cells Capture More | EE Times
- Smarter Sensor Hub Cuts Power | EE Times
- Quantum Computing: Diode-like Breakthrough Surmounts Roadblock | EE Times
- Nanoparticle Imaging with Graphene | EE Times
- 007 Movie Inspires Concept Cars | EE Times
- IBM Frees Open Source Apps | EE Times
- 3D Printed Electronics Are Here, Researchers Say | EE Times
- IBM Slashes Next-Gen Power | EE Times
- Top 10 Supercomputers in View | EE Times
- Intel Showcases Its Supercomputing Future at ISC | EE Times
- Supercomputing Centers-of-Excellence Twin | EE Times
- IBM Leapfrogs Intel to 7nm | EE Times
- Self/less Sheds Electronic Brain | EE Times
- Startup Beats HP, Hynix to Memristor Learning | EE Times
- Thin Film Solar Cells May Rival Silicon | EE Times
- FinFETs + FD-SOI Proposition: May Save Power | EE Times
- Biodegradable Electronics Debut | EE Times
- Somnium Soups Up Kinetis Code | EE Times
- Automotive King Redefines Future | EE Times
- Woz Wows with Humanitarianism | EE Times
- Freescale S32 Ups Automotive Ante | EE Times
- 'Smallest SoC for IoT' Adds Memory | EE Times
- Freescale i.MX 7 Finally Here | EE Times
- IBM Demos III-V FinFETs on Silicon | EE Times
- Wearables Get Their Own MEMS | EE Times
- Fairchild Out Smarts Dumb MEMS | EE Times
- IBM Sparks Machine Learning | EE Times
- TI Offers Wearable Evaluation Kit | EE Times
- Tiny Spirals May Make Counterfeiting Impossible | EE Times
- IBM Demos III-V on Silicon | EE Times
- Free Service Compares Devices | EE Times
- IBM Renting Its EDA Tools | EE Times
- Nanoscale Sensor Breakthrough May Lower Costs | EE Times
- City Smarts Marshalled in Germany | EE Times
- Intel Unveils Cores and Xeons | EE Times
- Industry's Most Sensitive MEMS Mic | EE Times
- Can Formula E Overtake Formula One? | EE Times
- Gaming Helps Tool Emulate True Power Peaks | EE Times
- Smart Factories Meet AI | EE Times
- Self-Driving Cars Without Passengers | EE Times
- Festo's Smart Robotics Aimed at SMC | EE Times
- IBM Demos CMOS Silicon Photonics | EE Times
- Samsung Breaks Ground on $14 Billion Fab | EE Times
- Intel's High-End Xeon E7v3 Debuts | EE Times
- Living Computers Ultimate Goal | EE Times
- Start-up's Co-Robots Handle Logistics | EE Times
- IBM Solves Quantum Computing | EE Times
- Ruggedized Tire Pressure Sensor Raises Bar | EE Times
- Elvis Sees All in Russia | EE Times
- TI Obsoletes FPGA | EE Times
- Aluminum Battery Recharges in 1sec | EE Times
- Moore's Law: Dead or Alive | EE Times
- IBM vs. Intel in Supercomputer Bout | EE Times
- 3D Testing Standardized by SRC | EE Times
- IBM Sets Memory Density Record | EE Times
- Sensor Hub Lowers the Power | EE Times
- Nanotube Circuits Learn Functions | EE Times
- Vote Today! Best Nanotech | EE Times
- Bell Labs Opens New Doors | EE Times
- Mentor Graphics Drives ISPD Contest | EE Times
- CoolCube 3D Goes Monolithic | EE Times
- Analog EDA Finally Automated | EE Times
- 3D Qualcomm SoCs by 2016 | EE Times
- Researchers Claim 44x Power Cuts | EE Times
- Robotic Bacteria Senses Humidity | EE Times
- Nanolaser Enables On-Chip Photonics | EE Times
- SynBio Stubs for Standards | EE Times
- Intel's Xeon Phi to House 72-Cores | EE Times
- Optical Color Shifter Computes Cognitively | EE Times
- Bi-directional RF Doubles Cellular Capacity | EE Times
- Insects Harnessed for Surveillance | EE Times
- Scientists Pursue Super-Fast Material | EE Times
- Tri-Core Sensor Hub Ups Ante: Sensors Included | EE Times
- Free Sirius One-Ups Siri | EE Times
- Heart On-A-Chip Beats | EE Times
- Intel's 1st Xeon SoC Twists ARM | EE Times
- Bosch Debuts 1st MEMS Sensor Hub | EE Times
- IBM's Watson Does Deep-Learning Too | EE Times
- 2D Material Beats Graphene | EE Times
- 3D Printing Everywhere from Lab to Factory | EE Times
- Graphene Polymer Speeds Electron Transport | EE Times
- Hi-Speed Transistors from Liquid Processing | EE Times
- Flash for Even Commodity Servers | EE Times
- 3D E-Beam Enables 3D NAND Flash | EE Times
- Quantum Transistor Harnesses New Effect | EE Times
- Microsoft, Google Beat Humans at Image Recognition | EE Times
- IBM Adds All Vendors to its Cloud-of-Clouds | EE Times
- CMOS Image Sensors Surpassing Moore's Law | EE Times
- Out Googling Google on Big Data Searches | EE Times
- Thermoelectric Nanowires to Cool Chips | EE Times
- Invisibility Cloaks Now Shield People from Sight | EE Times
- 2nd TransAsia To Crash in a Year | EE Times
- GE's Open-Source Smart Refrigerator | EE Times
- Supercapbatteries, Thermoelectrics to Power Future Cars | EE Times
- Intel 5th Gen vPro Goes 60GHz Wireless | EE Times
- Quantum Entanglement Now On-a-Chip | EE Times
- Co-Robots Working Alongside People | EE Times
- Intel, Microsoft, Autodesk Creating Life | EE Times
- $2 Waves 3D Gesture Into Any Device | EE Times
- Drones and Wearables App Store Launches | EE Times
- Ford Self-Driving Cars On-the-Cheap | EE Times
- Electronic Spine Cures Paralysis | EE Times
- CES 2015: Ultra-High-Definition 4K TV over Copper | EE Times
- CES 2015: MEMS that Wearables/IoT Need | EE Times
- CES: IoT Modules Quicken Innovation | EE Times
- Bosch Awash in MEMS Combo Sensors | EE Times
- Sony Chooses PNI Hub for SmartWatch | EE Times
- CES: 55 TV Thin as iPad Air | EE Times
- CES: 2 Displays on Russian Yota Smartphone | EE Times
- Electric/Hybrid Aircraft Takes Flight | EE Times
- MEMS Spurred by Industrial IoT | EE Times
- Researchers Superconduct at 140 Degrees | EE Times
- Spray Solar Cells on Any Surface | EE Times
- True 3-D Chips Harness Nanotubes | EE Times
- MIT Discovers Superconductor Law | EE Times
- Superconductor Unveils Room Temp Future | EE Times
- DARPA Offers Free Watson-Like Artificial Intelligence | EE Times
- MIT Spinoff Funded $143M to Create Sentient Computers | EE Times
- TI's Digital Light Processor Shrinks to Glasses Size | EE Times
- Biologists Grow Living Circuits | EE Times
- Moore's Law Competitor Wins $150K Elevator Pitch Prize | EE Times
- Stephen Hawking: How He Speaks & Spells | EE Times
- Carbon Nanobuds Flex, Replace Indium Tin Oxide | EE Times
- Flexible OLEDs Clear Last Hurdle | EE Times
- ST's Small 6-Axis IMU a Big Move Into Automotive | EE Times
- Superconductivity Predicted by Supercomputer | EE Times
- 3D Prints World's Best Inverter | EE Times
- Lucio Lanza to Receive EDA Honor | EE Times
- Nanotube Field Emitters Beat OLEDs | EE Times
- First 2D Atomic Piezoelectric Discovered | EE Times
- Intel, IBM Dueling 14nm FinFETS | EE Times
- World's Wireless Record Breaks 40 Gbit/s | EE Times
- China's 5-Year Plan Revealed | EE Times
- River Sensors to Clean Up Waterways | EE Times
- IBM's Watson Going Global | EE Times
- Cheap Fusion Beats Fossil Fuels | EE Times
- Why Do Big Companies Make Their Own Sensors? | EE Times
- $200M Photonics Effort to Keep US Ahead | EE Times
- Electronic Brain by 2023 | EE Times
- IBM Water Cooling Enables a Super Solar Dish | EE Times
- Fairchild Reinvents Itself | EE Times
- Google Glass & Lookalikes Find Niches | EE Times
- Moore's Law Has No End in Sight | EE Times
- Intel Xeon Boosts Workstation & Servers | EE Times
- Samsung Funds III-V FinFETs in US Lab | EE Times
- Always-On Touch Gestures Save Time & Battery | EE Times
- Indoor Navigation: The Next Big Thing | EE Times
- Free Process Design Kit Hits 15nm | EE Times
- The Limits of Moore's Law Limits | EE Times
- MIT Wrist-Robot Adds Extra Fingers | EE Times
- Cloud-Based Chip Design Research & Education | EE Times
- Energy Harvesting Chip Demonstrated | EE Times
- Movidius Vision Processing Unit Enters 2nd Generation | EE Times
- Gadget Uses Brain Waves to Control Household Functions | EE Times
- IBM Puts Brain On-a-Chip | EE Times
- Intel Readies Super-Resist for EUV | EE Times
- Flexible Displays Going Commercial | EE Times
- Bell Labs Hits 10 Gbit/s Broadband Over Copper | EE Times
- Invensense MEMS Merges With Movea Motion | EE Times
- MIT Puts 36-Core Internet on a Chip | EE Times
- Lowest Power MEMS Mic Cuts Noise | EE Times
- IBM Pledges Nanotube Transistor by 2020 or Bust | EE Times
- Top 10 Supercomputers Worldwide | EE Times
- Monolythic MEMS Sensor Cut Size/Cost | EE Times
- Intel Massive Parallel Upgrades Due | EE Times
- MEMS Microphones Busting Out All Over | EE Times
- Micron 3D Memory Supercharges Xeon Phi | EE Times
- First Ultrasonic MEMS Controller to Make Mobile Hands Free | EE Times
- Conductive Polymer Beats Indium Tin Oxide by 10x | EE Times
- Movidius Redefines Computer Vision | EE Times
- Intel & Georgia Tech Advance Spintronics | EE Times
- MEMS Clock Cuts Wearable Power in Half | EE Times
- SpaceX 3D Prints Rocket Thruster | EE Times
- Supercaps Breakthrough: Phone Case to Replace Battery | EE Times
- Cyborg-Like Bionics Harness Sunlight | EE Times
- IBM Sets World Record With Mag Tape | EE Times
- Novel, Inexpensive 3D Chips Funded by SRC | EE Times
- Neurogrid's Electronic Brain Controls Robotics | EE Times
- Aquifi's Gesture Interface Adapts | EE Times
- China Takes Lead in Carbon Nanotubes & Graphene | EE Times
- IBM's 3D Printer to Revolutionize Chip Prototyping | EE Times
- Ultracapacitor Breakthrough May Recharge Energy Storage | EE Times
- Cadence to Acquire Jasper | EE Times
- Archer Supercomputer Is Fastest in UK | EE Times
- ISPD-14 Focuses on FinFETs, Security, Supply Chain | EE Times
- NIST Sets New Time Standard | EE Times
- MEMS Mics Pass $1B Milestone | EE Times
- GE Claims Fastest, Highest-Power MEMS Switch | EE Times
- IBM Founds Watson Group | EE Times
- Mobile Boosts Processor Market | EE Times
- Stanene May Be Better Than Graphene | EE Times
- Ink-Jet Printing for OLED Displays Debuts | EE Times
- Intel to Customize High-End Processors | EE Times
- IBM Broadens Access to Ask Watson Apps | EE Times
- 5 MEMS Chips Debut at MEMS Exec Congress | EE Times
- Invisibility Cloak Comes to Life | EE Times
- Robot Rings Nasdaq Closing Bell | EE Times
- Samsung Tips $100 Million IoT Strategy | EE Times
- Allwinner IPO to Fuel Mobile Road Map | EE Times
- III-V FinFET Fabed on Silicon | EE Times
- Join Live Chat on Toyota Unintended Acceleration Wed. Nov. 6, 1PM ET | EE Times
- Graphene Laser to Probe Superconductivity | EE Times
- Motion Processing for Android KitKat | EE Times
- Sensor Hubs Arrive for Android | EE Times
- SK Hynix Licenses BeSang's 3D IC | EE Times
- Vicarious AI Passes Turing Test | EE Times
- Wearable Display Goes 1 Step Beyond Google Glass | EE Times
Thursday, June 11, 2015
Wednesday, October 22, 2014
"World's Wireless Record Breaks 40 Gbit/s"
LTE beat by 40X by a new protocol described this week at the Compound Semiconductor Integrated Circuits Symposium in San Diego. Next their aim is wireless 100 Gbit WLAN: R. Colin Johnson @NextGenLog
.jpg)
A 140 GHz transmitter chip, containing an I-Q modulator, a 3-stage amplifier, and an x3 frequency multiplier for the local oscillator measures just 1.6 x 1 square millimeters.
.jpg)
A 140 GHz transmitter chip, containing an I-Q modulator, a 3-stage amplifier, and an x3 frequency multiplier for the local oscillator measures just 1.6 x 1 square millimeters.
EETimes Story
Thursday, July 24, 2014
#ENERGY: "Energy Harvester Eliminates the Need for Batteries"
Vibration harvester from Omron/IMEC eliminates the need for batteries to wireless sensors on equipment that vibrates: R. Colin Johnson @NextGenLog

Imec and Omron collaborated on a board weighing just 15.4 grams and harvests vibrations to provide DC power to sensors in the 100 microwatt range.
Further Reading

Imec and Omron collaborated on a board weighing just 15.4 grams and harvests vibrations to provide DC power to sensors in the 100 microwatt range.
Further Reading
Tuesday, September 24, 2013
#ALGORITHMS: "Hacking Medical Implants Foiled"
When vice president Dick Cheney got a pacemaker, the Secret Service is said to have taken extra precautions to prevent hackers from reprogramming it. Now researchers at Rice University wants to provide even better safeguards for the rest of us. A new algorithm that uses the patients own heartbeat as a random password generator is said to prevent hackers from gaining wireless access to pacemakers, insulin pumps,defibrillators, neural implants, and drug delivery systems: R. Colin Johnson @NextGenLog

Rice University professor Farinaz Koushanfar (left) and her student Masoud Rostami (right) invented security technique for implantable medical devices that prevents wireless attacks.Further Reading

Rice University professor Farinaz Koushanfar (left) and her student Masoud Rostami (right) invented security technique for implantable medical devices that prevents wireless attacks.
Friday, August 30, 2013
#SENSORS: "Sixense to Kickstart its 1st Wireless Controller"
Kickstarter is not just enlisting consumer investors, but is now helping established companies attract new original equipment manufacturers (OEMs) into using their subsystems. Enter Sixense, whose Kickstarter project will be the only way to get advance access to its first wireless motion sensing technology. Sixense hopes that OEMs will sign-up to get their system development kit which allows them to embed the motion sensing module into their own controllers, such as head-mounted displays for virtual reality, or into sports equipment like a golf club for gaming: R. Colin Johnson @NextGenLog

Sixense's first wireless controller houses the oblong Sixense Tracking Embedded Module (STEM, left), which OEMs can embed to track motion in their own devices.

The STEM magnetic beacon and base station recharges two Sixense controllers and up to three power packs for OEMs embedded the motion sensing module in their own devices, like head mounted displays for virtual reality, or say a golf club for gaming.Further Reading

Sixense's first wireless controller houses the oblong Sixense Tracking Embedded Module (STEM, left), which OEMs can embed to track motion in their own devices.

The STEM magnetic beacon and base station recharges two Sixense controllers and up to three power packs for OEMs embedded the motion sensing module in their own devices, like head mounted displays for virtual reality, or say a golf club for gaming.
Monday, April 29, 2013
#WIRELESS: "Smart Switch Monetizes Cloud Mobility"
Today when carriers want to charge for mobile access to cloud services they need to add a network processing unit (NPU) or for super-high-throughput a specialized field-programmable gate array (FPGA). Now, however, Vitesse Semiconductor claims it has the world's first smart switch silicon for mobile access to cloud-services. Integrated into the Ethernet switching layer, Vitesse's Serval-2 Carrier Ethernet Switch Engine provides a cheaper more efficient hardware solution: R. Colin Johnson @NextGenLog

Vitesse Service Aware Architecture (ViSAA) is the only Ethernet switch smart enough to be aware of what services a user is accessing so that carriers can directly track mobile access and cloud-based usage for hierarchical quality of service (H-QoS) operations, administration management (OAM) including physical layer (PHY). Further Reading

Vitesse Service Aware Architecture (ViSAA) is the only Ethernet switch smart enough to be aware of what services a user is accessing so that carriers can directly track mobile access and cloud-based usage for hierarchical quality of service (H-QoS) operations, administration management (OAM) including physical layer (PHY).
Friday, April 12, 2013
#WIRELESS: "GapSense Aims to Boost WiFi Reception"
The 321 million WiFi enabled devices--more than the U.S. population of 315 million--is becoming an epidemic problem in interference, but now a proposed new technology called GapSense avoids collisions among signals: R. Colin Johnson @NextGenLog
Further Reading
Further Reading
Wednesday, April 03, 2013
#WIRELESS: "Facebook Home Replaces Lock Screen"
Facebook has released a suite of apps dubbed "Facebook Home" which takes over the lock screen of any Android device, replacing it with your real-time Facebook newsfeed: R. Colin Johnson @NextGenLog

Facebook Home shows a steady stream of friends’ posts and photos on your lock screen. Further Reading

Facebook Home shows a steady stream of friends’ posts and photos on your lock screen.
Friday, February 22, 2013
#DESIGNWest: "'Lifestyle of Mobility' Book Author to Speak"
In Harald Neidhardt's just-released book Lifestyle of Mobility, a hundred industry movers-and-shakers predict the future of mobile applications. Indeed, Neidhardt declares that the post-PC era is already upon us. Neidhardt has the tech cred to make that statement. He's the founder of MLove, which is both a mobility "lifestyle" Web site and a series of South-by-Southwest-like "ConFestivals."

Mobility apps are being integrated into nearly every consumer field, from health to automotive to games to music to retail and lifestyle electronics.
The mobility tipping point is upon us because current devices now house arrays of MEMS sensors. This opens up possibilities for "empathetic" electronics, which adapt their functions to users and their local environment. According to Neidhardt, the first wave of mobility was borne by the telecommunications giants, from AT&T (U.S.) to NTT (Japan), which built walled gardens around their wireless devices and associated services. The second wave rose as a result of the iPhone, which initiated the app-economy that is also enjoyed today by Google's Android, Amazon's Kindle and Microsoft's Windows Phone along with tablets from the Apple iPad to Samsung's Galaxy Tab. The third wave washing over us now is integrating mobility into every other nook and cranny of electronics by virtue of the inclusion of wireless connectivity and MEMS sensors. Connected homes, connected automobiles ,and connected tools of every type are leveraging ubiquitous sensors and processors to add smarts to everything we do. Thus the smartphone is becoming the remote control of our lives by virtue of apps that use its touchscreen as their human interface.
Further Reading

Mobility apps are being integrated into nearly every consumer field, from health to automotive to games to music to retail and lifestyle electronics.
The mobility tipping point is upon us because current devices now house arrays of MEMS sensors. This opens up possibilities for "empathetic" electronics, which adapt their functions to users and their local environment. According to Neidhardt, the first wave of mobility was borne by the telecommunications giants, from AT&T (U.S.) to NTT (Japan), which built walled gardens around their wireless devices and associated services. The second wave rose as a result of the iPhone, which initiated the app-economy that is also enjoyed today by Google's Android, Amazon's Kindle and Microsoft's Windows Phone along with tablets from the Apple iPad to Samsung's Galaxy Tab. The third wave washing over us now is integrating mobility into every other nook and cranny of electronics by virtue of the inclusion of wireless connectivity and MEMS sensors. Connected homes, connected automobiles ,and connected tools of every type are leveraging ubiquitous sensors and processors to add smarts to everything we do. Thus the smartphone is becoming the remote control of our lives by virtue of apps that use its touchscreen as their human interface.
Further Reading
Wednesday, February 06, 2013
#WIRELESS: "Smartphones, Tablets in Everybody's Future"
Apple sold almost 48 million iPhones in the fourth quarter of 2012 alone, but ABI Research claims that the total installed base of 45 million Windows Phones and 20 million Blackberry-10s is still enough to interest software app developers in supporting them. The total installed base of smartphones worldwide will be 1.4 billion by the end of 2013 with 57 percent running Android and 21 percent iOS; whereas there will be 268 million tablets total--62 percent using iOS and 28 percent Android. Annual growth for smartphones will be 44 percent and a whopping 125 percent for tablets, all according to ABI Research (Oyster Bay, N.Y.): R. Colin Johnson @NextGenLog
ABI’s Mobile Application Technologies Research Service takes a deep dive into the technologies enabling "transformative" applications.SOURCE: ABI Research
Further Reading
ABI’s Mobile Application Technologies Research Service takes a deep dive into the technologies enabling "transformative" applications.SOURCE: ABI Research
Further Reading
Tuesday, December 11, 2012
#CHIPS: "Intel's Atom Extends Mobile Battery Life"
Intel is still the number one chip maker worldwide, but not for long if trends keep pushing new users to smartphones and tablets instead of traditional PCs and laptops, since most of these mobile devices use ARM cores. The tide may turn in 2013, however, if Intel can deliver on the ultra-low-power Atom processor it unveiled today at IEDM: R. Colin Johnson @NextGenLog
Intel's FinFET transistors use three-dimensional (3-D) fins to increase the surface are of its gates, thus lowering leakage and increasing field strength for lower voltage power supplies--both of which boost battery lifetime for mobile devices.
Here is what GoParallel says about Intel's Atom: Intel is aiming to upgrade its Atom processor for the biggest growth areas were in mobile chips. The new low-power process for its mobile Atom processors was described at the International Electron Devices Meeting (IEDM 2012, San Francisco, Dec. 10-11). The new ultra-low-power Atom will extend the battery life of smartphones, tablets, netbooks, embedded systems and other wireless devices, according to Intel...
Further Reading
Intel's FinFET transistors use three-dimensional (3-D) fins to increase the surface are of its gates, thus lowering leakage and increasing field strength for lower voltage power supplies--both of which boost battery lifetime for mobile devices.
Here is what GoParallel says about Intel's Atom: Intel is aiming to upgrade its Atom processor for the biggest growth areas were in mobile chips. The new low-power process for its mobile Atom processors was described at the International Electron Devices Meeting (IEDM 2012, San Francisco, Dec. 10-11). The new ultra-low-power Atom will extend the battery life of smartphones, tablets, netbooks, embedded systems and other wireless devices, according to Intel...
Further Reading
Friday, October 26, 2012
#WIRELESS: "Telit's M2M Adopts LTE at 100Mbps"
The machine-to-machine (M2M) communications market got a boost to 100-Mbits per second by virtue of Telit's new LTE-based cellular modem technology: R. Colin Johnson
Here is what Telit says about its new 100Mbps M2M modem: Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the LE920 LTE module for European and North American OEM automotive and aftermarket segments. The new 920 form factor measures 34x40x2.8mm on a 198-pad LGA automotive-grade package. The product delivers 100Mbps-down and 50Mbps-up data rates on LTE networks and is fully fallback compatible with DC-HSPA+ delivering up to 42Mbs-down and 5.76Mbps-up where available. Quad-band GSM/GPRS and EDGE performance ensure the module connects even in remote areas devoid of 3G or 4G coverage. Equipped with a high performance multi-constellation GPS plus GLONASS receiver, the LE920 module provides superior navigation coverage even in harsh environments and challenging urban canyons with fast and accurate position fixes, making it ideally suited for full-featured integrated navigation systems and location based services delivered through the car’s infotainment system.
Telit’s LE920 includes distinguishing features such as Rx diversity which allows the end-device to be equipped with two distinct cellular antennas improving the quality and reliability of the wireless connectivity in urban areas, undergrounds, and other similar scenarios, making the product ideal for applications such as an in-vehicle hot-spot. Fully voice capable, the LE920 provides full-duplex PCM as well as analog input and output for applications such as a hands-free in-car cellular functionality, fleet management and other vehicle voice gateway applications. For easy integration, the product includes a USB 2.0 high-speed port and device drivers for most Windows and Linux platforms, and will be available in local variants as required for all major LTE carriers and partner networks in North America and Europe.
The LE920 was designed to meet the most current specifications for the European eCall and Russian ERA-Glonass programs. Mandated by the European Commission, all new cars must have an eCall automatic emergency in-vehicle call system installed by 2015. The system is designed to enhance quality and speed of rescue operations in automotive accident response efforts. In case of a crash, the eCall system transfers the necessary accident data to the nearest emergency service response center expediting life saving measures. ERA-Glonass was designed to be compatible with the European eCall standard. The objective of the program is to combine mobile communications and satellite positioning providing for faster assistance in case of automotive collisions. Its infrastructure is planned to be installed in 2013 with systems mandated in all vehicles in 2014. North America has no similar program.
“The LE920 is Telit’s new high-performance automotive product which also introduces to the market our new form-factor for this segment. One which provides our R&D and product management teams with lots of space for future integration of new and valuable features and resources for our automotive customers,” said Dominikus Hierl, chief marketing officer at Telit Wireless Solutions. “With the LE920’s comprehensive and industry-leading LTE multi-band support, the connected vehicle can provide passengers the same comfort and convenience in terms of internet and information access just as they would enjoy at the home or office - with no compromise in performance.”
As the LE920 was conceived specifically for the automotive market, it boasts an extended temperature range, operating from -40°C to +85°C, designed and manufactured under the strict automotive quality standards specified in the ISO/TS16949. Additionally, materials, facilities, and processes applied on the LE920 also comply with Production Part Approval Process or PPAP, a full traceability framework standard adopted by the automotive industry which among other things allows defective parts to be traced back in its full genealogy up the supply chain.
Industry’s only pure-play m2m, Telit creates value by partnering with customers to provide expert guidance and support from concept development through to manufacturing quickly bringing ideas to market in all application areas including the new “smart” space. With service enhanced products in cellular, short-range, and satellite-navigation easily bundled through high-level software interfaces, Telit-powered m2m devices cost less to integrate, maintain, operate, and update with lower price points for bundled products and savings translating into competitive advantage at the time of sale and throughout the operating life of the customer device.
Further Reading
Here is what Telit says about its new 100Mbps M2M modem: Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the LE920 LTE module for European and North American OEM automotive and aftermarket segments. The new 920 form factor measures 34x40x2.8mm on a 198-pad LGA automotive-grade package. The product delivers 100Mbps-down and 50Mbps-up data rates on LTE networks and is fully fallback compatible with DC-HSPA+ delivering up to 42Mbs-down and 5.76Mbps-up where available. Quad-band GSM/GPRS and EDGE performance ensure the module connects even in remote areas devoid of 3G or 4G coverage. Equipped with a high performance multi-constellation GPS plus GLONASS receiver, the LE920 module provides superior navigation coverage even in harsh environments and challenging urban canyons with fast and accurate position fixes, making it ideally suited for full-featured integrated navigation systems and location based services delivered through the car’s infotainment system.
Telit’s LE920 includes distinguishing features such as Rx diversity which allows the end-device to be equipped with two distinct cellular antennas improving the quality and reliability of the wireless connectivity in urban areas, undergrounds, and other similar scenarios, making the product ideal for applications such as an in-vehicle hot-spot. Fully voice capable, the LE920 provides full-duplex PCM as well as analog input and output for applications such as a hands-free in-car cellular functionality, fleet management and other vehicle voice gateway applications. For easy integration, the product includes a USB 2.0 high-speed port and device drivers for most Windows and Linux platforms, and will be available in local variants as required for all major LTE carriers and partner networks in North America and Europe.
The LE920 was designed to meet the most current specifications for the European eCall and Russian ERA-Glonass programs. Mandated by the European Commission, all new cars must have an eCall automatic emergency in-vehicle call system installed by 2015. The system is designed to enhance quality and speed of rescue operations in automotive accident response efforts. In case of a crash, the eCall system transfers the necessary accident data to the nearest emergency service response center expediting life saving measures. ERA-Glonass was designed to be compatible with the European eCall standard. The objective of the program is to combine mobile communications and satellite positioning providing for faster assistance in case of automotive collisions. Its infrastructure is planned to be installed in 2013 with systems mandated in all vehicles in 2014. North America has no similar program.
“The LE920 is Telit’s new high-performance automotive product which also introduces to the market our new form-factor for this segment. One which provides our R&D and product management teams with lots of space for future integration of new and valuable features and resources for our automotive customers,” said Dominikus Hierl, chief marketing officer at Telit Wireless Solutions. “With the LE920’s comprehensive and industry-leading LTE multi-band support, the connected vehicle can provide passengers the same comfort and convenience in terms of internet and information access just as they would enjoy at the home or office - with no compromise in performance.”
As the LE920 was conceived specifically for the automotive market, it boasts an extended temperature range, operating from -40°C to +85°C, designed and manufactured under the strict automotive quality standards specified in the ISO/TS16949. Additionally, materials, facilities, and processes applied on the LE920 also comply with Production Part Approval Process or PPAP, a full traceability framework standard adopted by the automotive industry which among other things allows defective parts to be traced back in its full genealogy up the supply chain.
Industry’s only pure-play m2m, Telit creates value by partnering with customers to provide expert guidance and support from concept development through to manufacturing quickly bringing ideas to market in all application areas including the new “smart” space. With service enhanced products in cellular, short-range, and satellite-navigation easily bundled through high-level software interfaces, Telit-powered m2m devices cost less to integrate, maintain, operate, and update with lower price points for bundled products and savings translating into competitive advantage at the time of sale and throughout the operating life of the customer device.
Further Reading
Subscribe to:
Posts (Atom)




