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Showing posts sorted by date for query wireless:. Sort by relevance Show all posts
Showing posts sorted by date for query wireless:. Sort by relevance Show all posts

Friday, February 28, 2020

#NEWS Hacking Bluetooth


Bluetooth wirelessly connects (or pairs) Internet of Things (IoT) devices—usually wireless peripherals such as ear-buds, speakers, watches, health monitors and location beacons—with host wireless devices such as smartphones or tablets. The limited physical distance between hosts and peripherals, unfortunately, has resulted in their cybersecurity being lax, according to Carl Gunter, a professor in the computer science department of the University of Illinois at Urbana-Champaign.

FULL TEXT

Wednesday, May 17, 2017

Entries from 2017-2018

NextGenLog: 2017-2018
   
Imec Aims 2-D FETs at Sub-5-nm Node | EE Times
   
TI Claims to Obsolete FPGAs for Embedded Apps | EE Times
   
NIST Backs Quantum-level Temperature Measurement | EE Times
   
ReRAM Goes 3D | EE Times
   
'E-Brain' to Pilot Air Force Jets | EE Times
   
Intel Banks on Artificial Intelligence | EE Times
   
Cray Moves to Lasso 'Big Data Deluge' | EE Times
   
Germanium Displacing GaAs for RF Transistors | EE Times
   
'Supercomputer-as-a-Service' Model is Born | EE Times
   
IBM Optics Go CMOS | EE Times
   
Researchers Print Stretchable Battery to Light Wearables | EE Times
   
GaAs Nanowires Boost Solar | EE Times
   
Is Elon Musk's Brain Cap Viable? | EE Times
   
Cray Rolls Clustered Supercomputers for AI | EE Times
   
Quantum Molecules Compute | EE Times
   
Coventor Touts Unified MEMS Platform | EE Times
   
3-D Graphene Boosts Electronics | EE Times
   
Researchers Create Artificial Synapse For Electronic Brains | EE Times
   
Intel Re-defines Xeons | EE Times
   
DoE Claims 1nm Fab Record | EE Times
   
Single-Pixel Camera Mimics Human Eye | EE Times
   
New Method Cuts Cost of GaAs Circuits | EE Times
   
Smart Semi Fiber Does It All | EE Times
   
Star Trek Tricorder Arrives | EE Times
   
Quantum Photons Emitted | EE Times
   
Researchers Developing Touch Sensitivity for Your Levi's | EE Times
   
IBM Bests Insulators | EE Times
   
ISPD Predicts Chip Futures | EE Times
   
Intel Shows Life Beyond CMOS | EE Times
   
TSMC Joins Chip Research Consortium | EE Times
   
3-D Interactive Projection Redefines MEMS | EE Times
   
Peer-to-peer IBM App Bypasses Carriers | EE Times
   
Atomic-scale Electronics Probed | EE Times
   
Hydrogen Fuel Cells: DOE Finds Faster, Cheaper Catalyst | EE Times
   
Samsung Beats Apple to Punch with MEMS Antenna Tuning Array | EE Times
   
Space X: L.A. to S.F. in 35 Minutes | EE Times
   
Bosch Dev Kit to Ease IoT | EE Times
   
Quantum Computing on Cusp | EE Times
   
Smartphone Senses Anything | EE Times
   
Nanotube Contacts Perfected | EE Times
   
Thinnest Nanowire Self-assembles | EE Times
   
China Returns Navy Sea Drone | EE Times
   
DARPA Funds Small Businesses with Big Ideas | EE Times
   
Software Finds Research for You | EE Times
   
Biometrics Won't Kill Passwords | EE Times
   
Cray Sets Deep Learning Milestone | EE Times
   
Biometrics Ensure Security | EE Times
   
1st Qubits on 300mm CMOS | EE Times
   
Watson IDs Heart Disease | EE Times
   
1st Photonic Circuits Here | EE Times
   
Photonics 3-D Modeler Born | EE Times
   
Smartphone-Bound VR/AR to Be Boosted by Lasers | EE Times
   
3D Printed Buses Here | EE Times
   
AT&T: SIMs are Key to IoT Future | EE Times
   
Coating Stops Exploding Batteries | EE Times
   
IEEE Sensor 2016 Exhibits MEMS | EE Times
   
DARPA's N-Zero Sensors Use 0 Power | EE Times
   
Watson Wins GM | EE Times
   
Watson Use Proliferating | EE Times
   
U.S. Protecting Us from AI | EE Times
   
4DS Memristors Target ReRAMs | EE Times
   
Oxygen Layer May Extend Moore's Law | EE Times
   
Nobel Prize: Why Superconductivity? | EE Times
   
Software Predicts Power Component Failure | EE Times
   
Biometrics May Replace Phone Passwords | EE Times
   
Universal Memristor Models All | EE Times
   
5G Powered by MEMS | EE Times
   
Transistor Trick Beats Moore | EE Times
   
Biometrics Upgrade to AirPod-like Earbuds | EE Times
   
SGI Supercomputes Ireland | EE Times
   
IoT 3 in 1 Tape Measure Get Crowdfunding Love | EE Times
   
Indoor Nav Leverages LTE | EE Times
   
Ford / MIT Collaborate on Future | EE Times
   
Advances Get a Grip on Single Photons & Molecules | EE Times
   
Watson for the Masses | EE Times
   
E-Retailers Automate Fulfillment | EE Times
   
EPA Crowdsources Pollution Sensing | EE Times
   
Intel to Acquire Deep Learning Nervana | EE Times
   
IBM Lab on Chip Detects Cancer | EE Times
   
2-D PV to Rival Graphene | EE Times
   
Next-Gen IoT Consortium Launches | EE Times
   
Oxides Make Ultra Conductor | EE Times
   
Spray-On Solar Material Holds Promise | EE Times
   
Cray, Deloitte Don White Hat in Security Service | EE Times
   
Stacking Boosts Polarimetry | EE Times
   
Quantum Superconducting Advance | EE Times
   
Intelligence Agency Sets 3D Challenge | EE Times
   
IBM, Samsung Put New Spin on MRAM | EE Times
   
Co-Robots Tend 3-D Printers | EE Times
   
Intel Xeon Phi Solos | EE Times
   
IBM to Donate Cognitive Analytics/Learning | EE Times
   
DAC: Coventor Adds Electrical Analytics | EE Times
   
Intel's Xeon Tackles Real Time | EE Times
   
Russian Make Diamond MEMS Resonators | EE Times
   
Intel Broadens Xeon Video Offerings | EE Times
   
Ultra-Dense 3-D Packaging for IoT | EE Times
   
NXP Aims to Target IoT | EE Times
   
NXP Focuses on Smart Cities, Security in Keynote | EE Times
   
IoT Security: Taming a Perfect Storm | EE Times
   
Magnetic Graphene Possible | EE Times
   
Diamond ICs May Finally Debut | EE Times
   
Analog Brain to Simulate Real Thing | EE Times
   
Graphene Patterned at Room Temp | EE Times
   
MIT: Changing Coal into Circuitry | EE Times
   
Harvest Electricity from Magnetism | EE Times
   
Cutting Antenna Design Time | EE Times
   
Russia, U.S. Get Closer to Universal Memory | EE Times
   
Quantum Dots Boost Solar Cells | EE Times
   
CMOS Circulator Chip Enables Single Antenna | EE Times
   
Can Einstein Be Wrong About Naked Singularities? | EE Times
   
Superconductor Nearing Room Temp | EE Times
   
IBM Neurocomputer Detailed | EE Times
   
Intel Plans A Future of CMOS | EE Times
   
Intel's Xeon E5 in the Clouds | EE Times
   
NeuroComputer to Shepherd Nukes | EE Times
   
Ultrasonic LCDs Sans ITO | EE Times
   
Top Robots for Farmers for 2016 | EE Times
   
Concept of Superconducting Memory To Be Tested | EE Times
   
Google Divesting Humanoid Robots | EE Times
   
Last MEMS Oscillator Maker Standing | EE Times
   
MEMS Grand Challenge Debuts | EE Times
   
Leti Solves Silicon Resonator Mystery | EE Times
   
Quantum Computers Crack Public-Key Encryption | EE Times
   
Decoding Electronic Materials Genome | EE Times
   
MRAM Breakthrough Looms | EE Times
   
E.U. Tackles III-V on CMOS | EE Times
   
Engineers Week Turns 65 | EE Times
   
Watson XPrize Worth $5 Million | EE Times
   
IBM CEO: Reinventing IBM's Profit Stream | EE Times
   
IBM Claims Tamper-Resistant Server | EE Times
   
DARPA to Remake Itself Leaner | EE Times
   
Transistors Minus Semiconductors | EE Times
   
Cavendish MEMS Displace SOI | EE Times
   
Taiwan Pursues White LED | EE Times
   
Robots Get A Gentler Grip | EE Times
   
Russians' Report Memristors | EE Times
   
Artificial Intelligence Pioneer Marvin Minsky Dead at 88 | EE Times
   
Cardboard Energy Harvester | EE Times
   
IoT Shoots for the Stars | EE Times
   
Memristor Computer Emulates Brain Functions | EE Times
   
Intel Thwarts Hackers | EE Times
   
Little Pharm Born | EE Times
   
Imec Melds Flash/III-V | EE Times
   
Micron 3-D NAND Back to Moore | EE Times
   
MediaTek 5G Combines Heterogenous Dark Silicon | EE Times
   
CES: ASIC Enables Location Services | EE Times
   
TSensors to Predict Natural Disasters | EE Times
   
Intel Funds Doctor in Your Pocket | EE Times
   
DARPA Funds Atoms-to-Products Breakthrough | EE Times
   
Skin Cancer Biopsied by Optical Scan | EE Times
   
Co-Robots: Taiwanese Style | EE Times
   
Roadmap to Trillion Sensors Forks | EE Times
   
One-Transistor SRAM Stuffs More Into CMOS | EE Times
   
IBM Forecaster Cuts Pollution, Energy Waste | EE Times
   
Tech & Climate: Stanford's Grand, Green Plan | EE Times
   
Tech Tackles Climate Change: Wind & Will Power | EE Times
   
2016: Year of the Nanotube Transistor? | EE Times
   
Technology Tackling Climate Change | EE Times
   
MEMS Market: Ups and Upstarts | EE Times
   
TrulySecure Embeds Biometrics | EE Times
   
Menta eFPGAs Win Over E.U. | EE Times
   
Intel Scales System Framework | EE Times
   
Chinese Spending All-Out on HPCs | EE Times
   
MEMS for Million-Dollar Horses | EE Times
   
Write-Once Memory Speeds Up, Powers Down Reads | EE Times
   
Micron Persistent Memory Pairs RAM/Flash | EE Times
   
Oculus Originator Gives Away MEMS Version | EE Times
   
Audio Digital Signal Processing Without the Experts | EE Times
   
Slideshow: BMW's Hybrid EVs | EE Times
   
IBM's Watson Tackles Sports | EE Times
   
Mentor Graphics Speeds Ethernet Verification | EE Times
   
Saxony Leads Germany's Semis | EE Times
   
IBM Flash Downtime 30-Seconds per Year | EE Times
   
Silicon on Insulator Penetrates Apple/Intel/IBM | EE Times
   
Organics To Extend Moore's Law | EE Times
   
5G for Command & Control | EE Times
   
Put FPGAs In Your SoCs | EE Times
   
IBM Nanotubes May Redefine Future of Moore's Law | EE Times
   
ASICs Memory Bandwidth Issue Fix Offered | EE Times
   
3D Memory Chips May Beat 3D Hybrid Memory Cube | EE Times
   
Watson-Type Machine Learning Affordable for Small Business | EE Times
   
MotionEngine Wear Debuts | EE Times
   
Solar Cells Made Obsolete | EE Times
   
VW's Woes Could be Solved by Tailpipe Add-on | EE Times
   
3-D Invisibility Guaranteed | EE Times
   
Will Semiconductors Last Forever? | EE Times
   
NIST Hits Quantum Teleport Key Out of the Park | EE Times
   
3D Printed Parts Help Regenerate Nerves | EE Times
   
Google Unveils Project Aura | EE Times
   
NASA Robots Proliferate | EE Times
   
Glasses Foil Facial Recognition | News | Communications of the ACM
   
Superconducting Graphene Beckons | EE Times
   
Philips' Home Medicine Connects to Medical Records | EE Times
   
Software Regulates Voltage in Everyday APUs | EE Times
   
Smart Prosthetics to Learn Mind Reading | EE Times
   
Post-Silicon Tech Compared | EE Times
   
Green Gaming is Possible | EE Times
   
IBM mbed with ARM | EE Times
   
LED Displays Get Wearable | EE Times
   
SiC/GaN Poised for Power | EE Times
   
LEDs Get As Cheap as Bulbs | EE Times
   
'Future Frontier' Sees Drones, Space | EE Times
   
Intel's Open-Source Fabric Supersizes Comm for Data | EE Times
   
Fabless RF Filters Cut Size, Share Same Die | EE Times
   
iPhone6 Powered by Hydrogen | EE Times
   
Quantum Highway Frictionless | EE Times
   
5G the Free WiFi Killer | EE Times
   
Plastic Solar Cells Double Output | EE Times
   
Metamaterials Single-Out One Voice | EE Times
   
Graphene Ribbons Grow on Germanium | EE Times
   
RRAM Breaks Records with Graphene | EE Times
   
IBM Watson Ready for Kick Off | EE Times
   
'Black Dart' Counters Drones | EE Times
   
3D Cursors Sculpt at Siggraph | EE Times
   
Solar Cell, Battery Combo May Simplify Power Generation | EE Times
   
Intel's Skylake Debuts at Gamecon | EE Times
   
Semiconductor-less Transistors the Goal | EE Times
   
Terahertz Optical Transistors Beat Silicon | EE Times
   
NASA Preps Venus ICs | EE Times
   
Hybrid Solar Cells Capture More | EE Times
   
Smarter Sensor Hub Cuts Power | EE Times
   
Quantum Computing: Diode-like Breakthrough Surmounts Roadblock | EE Times
   
Nanoparticle Imaging with Graphene | EE Times
   
007 Movie Inspires Concept Cars | EE Times
   
IBM Frees Open Source Apps | EE Times
   
3D Printed Electronics Are Here, Researchers Say | EE Times
   
IBM Slashes Next-Gen Power | EE Times
   
Top 10 Supercomputers in View | EE Times
   
Intel Showcases Its Supercomputing Future at ISC | EE Times
   
Supercomputing Centers-of-Excellence Twin | EE Times
   
IBM Leapfrogs Intel to 7nm | EE Times
   
Self/less Sheds Electronic Brain | EE Times
   
Startup Beats HP, Hynix to Memristor Learning | EE Times
   
Thin Film Solar Cells May Rival Silicon | EE Times
   
FinFETs + FD-SOI Proposition: May Save Power | EE Times
   
Biodegradable Electronics Debut | EE Times
   
Somnium Soups Up Kinetis Code | EE Times
   
Automotive King Redefines Future | EE Times
   
Woz Wows with Humanitarianism | EE Times
   
Freescale S32 Ups Automotive Ante | EE Times
   
'Smallest SoC for IoT' Adds Memory | EE Times
   
Freescale i.MX 7 Finally Here | EE Times
   
IBM Demos III-V FinFETs on Silicon | EE Times
   
Wearables Get Their Own MEMS | EE Times
   
Fairchild Out Smarts Dumb MEMS | EE Times
   
IBM Sparks Machine Learning | EE Times
   
TI Offers Wearable Evaluation Kit | EE Times
   
Tiny Spirals May Make Counterfeiting Impossible | EE Times
   
IBM Demos III-V on Silicon | EE Times
   
Free Service Compares Devices | EE Times
   
IBM Renting Its EDA Tools | EE Times
   
Nanoscale Sensor Breakthrough May Lower Costs | EE Times
   
City Smarts Marshalled in Germany | EE Times
   
Intel Unveils Cores and Xeons | EE Times
   
Industry's Most Sensitive MEMS Mic | EE Times
   
Can Formula E Overtake Formula One? | EE Times
   
Gaming Helps Tool Emulate True Power Peaks | EE Times
   
Smart Factories Meet AI | EE Times
   
Self-Driving Cars Without Passengers | EE Times
   
Festo's Smart Robotics Aimed at SMC | EE Times
   
IBM Demos CMOS Silicon Photonics | EE Times
   
Samsung Breaks Ground on $14 Billion Fab | EE Times
   
Intel's High-End Xeon E7v3 Debuts | EE Times
   
Living Computers Ultimate Goal | EE Times
   
Start-up's Co-Robots Handle Logistics | EE Times
   
IBM Solves Quantum Computing | EE Times
   
Ruggedized Tire Pressure Sensor Raises Bar | EE Times
   
Elvis Sees All in Russia | EE Times
   
TI Obsoletes FPGA | EE Times
   
Aluminum Battery Recharges in 1sec | EE Times
   
Moore's Law: Dead or Alive | EE Times
   
IBM vs. Intel in Supercomputer Bout | EE Times
   
3D Testing Standardized by SRC | EE Times
   
IBM Sets Memory Density Record | EE Times
   
Sensor Hub Lowers the Power | EE Times
   
Nanotube Circuits Learn Functions | EE Times
   
Vote Today! Best Nanotech | EE Times
   
Bell Labs Opens New Doors | EE Times
   
Mentor Graphics Drives ISPD Contest | EE Times
   
CoolCube 3D Goes Monolithic | EE Times
   
Analog EDA Finally Automated | EE Times
   
3D Qualcomm SoCs by 2016 | EE Times
   
Researchers Claim 44x Power Cuts | EE Times
   
Robotic Bacteria Senses Humidity | EE Times
   
Nanolaser Enables On-Chip Photonics | EE Times
   
SynBio Stubs for Standards | EE Times
   
Intel's Xeon Phi to House 72-Cores | EE Times
   
Optical Color Shifter Computes Cognitively | EE Times
   
Bi-directional RF Doubles Cellular Capacity | EE Times
   
Insects Harnessed for Surveillance | EE Times
   
Scientists Pursue Super-Fast Material | EE Times
   
Tri-Core Sensor Hub Ups Ante: Sensors Included | EE Times
   
Free Sirius One-Ups Siri | EE Times
   
Heart On-A-Chip Beats | EE Times
   
Intel's 1st Xeon SoC Twists ARM | EE Times
   
Bosch Debuts 1st MEMS Sensor Hub | EE Times
   
IBM's Watson Does Deep-Learning Too | EE Times
   
2D Material Beats Graphene | EE Times
   
3D Printing Everywhere from Lab to Factory | EE Times
   
Graphene Polymer Speeds Electron Transport | EE Times
   
Hi-Speed Transistors from Liquid Processing | EE Times
   
Flash for Even Commodity Servers | EE Times
   
3D E-Beam Enables 3D NAND Flash | EE Times
   
Quantum Transistor Harnesses New Effect | EE Times
   
Microsoft, Google Beat Humans at Image Recognition | EE Times
   
IBM Adds All Vendors to its Cloud-of-Clouds | EE Times
   
CMOS Image Sensors Surpassing Moore's Law | EE Times
   
Out Googling Google on Big Data Searches | EE Times
   
Thermoelectric Nanowires to Cool Chips | EE Times
   
Invisibility Cloaks Now Shield People from Sight | EE Times
   
2nd TransAsia To Crash in a Year | EE Times
   
GE's Open-Source Smart Refrigerator | EE Times
   
Supercapbatteries, Thermoelectrics to Power Future Cars | EE Times
   
Intel 5th Gen vPro Goes 60GHz Wireless | EE Times
   
Quantum Entanglement Now On-a-Chip | EE Times
   
Co-Robots Working Alongside People | EE Times
   
Intel, Microsoft, Autodesk Creating Life | EE Times
   
$2 Waves 3D Gesture Into Any Device | EE Times
   
Drones and Wearables App Store Launches | EE Times
   
Ford Self-Driving Cars On-the-Cheap | EE Times
   
Electronic Spine Cures Paralysis | EE Times
   
CES 2015: Ultra-High-Definition 4K TV over Copper | EE Times
   
CES 2015: MEMS that Wearables/IoT Need | EE Times
   
CES: IoT Modules Quicken Innovation | EE Times
   
Bosch Awash in MEMS Combo Sensors | EE Times
   
Sony Chooses PNI Hub for SmartWatch | EE Times
   
CES: 55 TV Thin as iPad Air | EE Times
   
CES: 2 Displays on Russian Yota Smartphone | EE Times
   
Electric/Hybrid Aircraft Takes Flight | EE Times
   
MEMS Spurred by Industrial IoT | EE Times
   
Researchers Superconduct at 140 Degrees | EE Times
   
Spray Solar Cells on Any Surface | EE Times
   
True 3-D Chips Harness Nanotubes | EE Times
   
MIT Discovers Superconductor Law | EE Times
   
Superconductor Unveils Room Temp Future | EE Times
   
DARPA Offers Free Watson-Like Artificial Intelligence | EE Times
   
MIT Spinoff Funded $143M to Create Sentient Computers | EE Times
   
TI's Digital Light Processor Shrinks to Glasses Size | EE Times
   
Biologists Grow Living Circuits | EE Times
   
Moore's Law Competitor Wins $150K Elevator Pitch Prize | EE Times
   
Stephen Hawking: How He Speaks & Spells | EE Times
   
Carbon Nanobuds Flex, Replace Indium Tin Oxide | EE Times
   
Flexible OLEDs Clear Last Hurdle | EE Times
   
ST's Small 6-Axis IMU a Big Move Into Automotive | EE Times
   
Superconductivity Predicted by Supercomputer | EE Times
   
3D Prints World's Best Inverter | EE Times
   
Lucio Lanza to Receive EDA Honor | EE Times
   
Nanotube Field Emitters Beat OLEDs | EE Times
   
First 2D Atomic Piezoelectric Discovered | EE Times
   
Intel, IBM Dueling 14nm FinFETS | EE Times
   
World's Wireless Record Breaks 40 Gbit/s | EE Times
   
China's 5-Year Plan Revealed | EE Times
   
River Sensors to Clean Up Waterways | EE Times
   
IBM's Watson Going Global | EE Times
   
Cheap Fusion Beats Fossil Fuels | EE Times
   
Why Do Big Companies Make Their Own Sensors? | EE Times
   
$200M Photonics Effort to Keep US Ahead | EE Times
   
Electronic Brain by 2023 | EE Times
   
IBM Water Cooling Enables a Super Solar Dish | EE Times
   
Fairchild Reinvents Itself | EE Times
   
Google Glass & Lookalikes Find Niches | EE Times
   
Moore's Law Has No End in Sight | EE Times
   
Intel Xeon Boosts Workstation & Servers | EE Times
   
Samsung Funds III-V FinFETs in US Lab | EE Times
   
Always-On Touch Gestures Save Time & Battery | EE Times
   
Indoor Navigation: The Next Big Thing | EE Times
   
Free Process Design Kit Hits 15nm | EE Times
   
The Limits of Moore's Law Limits | EE Times
   
MIT Wrist-Robot Adds Extra Fingers | EE Times
   
Cloud-Based Chip Design Research & Education | EE Times
   
Energy Harvesting Chip Demonstrated | EE Times
   
Movidius Vision Processing Unit Enters 2nd Generation | EE Times
   
Gadget Uses Brain Waves to Control Household Functions | EE Times
   
IBM Puts Brain On-a-Chip | EE Times
   
Intel Readies Super-Resist for EUV | EE Times
   
Flexible Displays Going Commercial | EE Times
   
Bell Labs Hits 10 Gbit/s Broadband Over Copper | EE Times
   
Invensense MEMS Merges With Movea Motion | EE Times
   
MIT Puts 36-Core Internet on a Chip | EE Times
   
Lowest Power MEMS Mic Cuts Noise | EE Times
   
IBM Pledges Nanotube Transistor by 2020 or Bust | EE Times
   
Top 10 Supercomputers Worldwide | EE Times
   
Monolythic MEMS Sensor Cut Size/Cost | EE Times
   
Intel Massive Parallel Upgrades Due | EE Times
   
MEMS Microphones Busting Out All Over | EE Times
   
Micron 3D Memory Supercharges Xeon Phi | EE Times
   
First Ultrasonic MEMS Controller to Make Mobile Hands Free | EE Times
   
Conductive Polymer Beats Indium Tin Oxide by 10x | EE Times
   
Movidius Redefines Computer Vision | EE Times
   
Intel & Georgia Tech Advance Spintronics | EE Times
   
MEMS Clock Cuts Wearable Power in Half | EE Times
   
SpaceX 3D Prints Rocket Thruster | EE Times
   
Supercaps Breakthrough: Phone Case to Replace Battery | EE Times
   
Cyborg-Like Bionics Harness Sunlight | EE Times
   
IBM Sets World Record With Mag Tape | EE Times
   
Novel, Inexpensive 3D Chips Funded by SRC | EE Times
   
Neurogrid's Electronic Brain Controls Robotics | EE Times
   
Aquifi's Gesture Interface Adapts | EE Times
   
China Takes Lead in Carbon Nanotubes & Graphene | EE Times
   
IBM's 3D Printer to Revolutionize Chip Prototyping | EE Times
   
Ultracapacitor Breakthrough May Recharge Energy Storage | EE Times
   
Cadence to Acquire Jasper | EE Times
   
Archer Supercomputer Is Fastest in UK | EE Times
   
ISPD-14 Focuses on FinFETs, Security, Supply Chain | EE Times
   
NIST Sets New Time Standard | EE Times
   
MEMS Mics Pass $1B Milestone | EE Times
   
GE Claims Fastest, Highest-Power MEMS Switch | EE Times
   
IBM Founds Watson Group | EE Times
   
Mobile Boosts Processor Market | EE Times
   
Stanene May Be Better Than Graphene | EE Times
   
Ink-Jet Printing for OLED Displays Debuts | EE Times
   
Intel to Customize High-End Processors | EE Times
   
IBM Broadens Access to Ask Watson Apps | EE Times
   
5 MEMS Chips Debut at MEMS Exec Congress | EE Times
   
Invisibility Cloak Comes to Life | EE Times
   
Robot Rings Nasdaq Closing Bell | EE Times
   
Samsung Tips $100 Million IoT Strategy | EE Times
   
Allwinner IPO to Fuel Mobile Road Map | EE Times
   
III-V FinFET Fabed on Silicon | EE Times
   
Join Live Chat on Toyota Unintended Acceleration Wed. Nov. 6, 1PM ET | EE Times
   
Graphene Laser to Probe Superconductivity | EE Times
   
Motion Processing for Android KitKat | EE Times
   
Sensor Hubs Arrive for Android | EE Times
   
SK Hynix Licenses BeSang's 3D IC | EE Times
   
Vicarious AI Passes Turing Test | EE Times
   
Wearable Display Goes 1 Step Beyond Google Glass | EE Times

Thursday, June 11, 2015

#NEWS: "Kumu Instantly Doubles Bandwidth of Any Wireless Network" #Wireless





Wednesday, October 22, 2014

"World's Wireless Record Breaks 40 Gbit/s"

LTE beat by 40X by a new protocol described this week at the Compound Semiconductor Integrated Circuits Symposium in San Diego. Next their aim is wireless 100 Gbit WLAN: R. Colin Johnson @NextGenLog


A 140 GHz transmitter chip, containing an I-Q modulator, a 3-stage amplifier, and an x3 frequency multiplier for the local oscillator measures just 1.6 x 1 square millimeters.

EETimes Story

Thursday, July 24, 2014

#ENERGY: "Energy Harvester Eliminates the Need for Batteries"

Vibration harvester from Omron/IMEC eliminates the need for batteries to wireless sensors on equipment that vibrates: R. Colin Johnson @NextGenLog


Imec and Omron collaborated on a board weighing just 15.4 grams and harvests vibrations to provide DC power to sensors in the 100 microwatt range.

Further Reading

Tuesday, September 24, 2013

#ALGORITHMS: "Hacking Medical Implants Foiled"

When vice president Dick Cheney got a pacemaker, the Secret Service is said to have taken extra precautions to prevent hackers from reprogramming it. Now researchers at Rice University wants to provide even better safeguards for the rest of us. A new algorithm that uses the patients own heartbeat as a random password generator is said to prevent hackers from gaining wireless access to pacemakers, insulin pumps,defibrillators, neural implants, and drug delivery systems: R. Colin Johnson @NextGenLog


Rice University professor Farinaz Koushanfar (left) and her student Masoud Rostami (right) invented security technique for implantable medical devices that prevents wireless attacks.
Further Reading

Friday, August 30, 2013

#SENSORS: "Sixense to Kickstart its 1st Wireless Controller"

Kickstarter is not just enlisting consumer investors, but is now helping established companies attract new original equipment manufacturers (OEMs) into using their subsystems. Enter Sixense, whose Kickstarter project will be the only way to get advance access to its first wireless motion sensing technology. Sixense hopes that OEMs will sign-up to get their system development kit which allows them to embed the motion sensing module into their own controllers, such as head-mounted displays for virtual reality, or into sports equipment like a golf club for gaming: R. Colin Johnson @NextGenLog


Sixense's first wireless controller houses the oblong Sixense Tracking Embedded Module (STEM, left), which OEMs can embed to track motion in their own devices.


The STEM magnetic beacon and base station recharges two Sixense controllers and up to three power packs for OEMs embedded the motion sensing module in their own devices, like head mounted displays for virtual reality, or say a golf club for gaming.
Further Reading

Monday, April 29, 2013

#WIRELESS: "Smart Switch Monetizes Cloud Mobility"

Today when carriers want to charge for mobile access to cloud services they need to add a network processing unit (NPU) or for super-high-throughput a specialized field-programmable gate array (FPGA). Now, however, Vitesse Semiconductor claims it has the world's first smart switch silicon for mobile access to cloud-services. Integrated into the Ethernet switching layer, Vitesse's Serval-2 Carrier Ethernet Switch Engine provides a cheaper more efficient hardware solution: R. Colin Johnson @NextGenLog


Vitesse Service Aware Architecture (ViSAA) is the only Ethernet switch smart enough to be aware of what services a user is accessing so that carriers can directly track mobile access and cloud-based usage for hierarchical quality of service (H-QoS) operations, administration management (OAM) including physical layer (PHY).
Further Reading

Friday, April 12, 2013

#WIRELESS: "GapSense Aims to Boost WiFi Reception"

The 321 million WiFi enabled devices--more than the U.S. population of 315 million--is becoming an epidemic problem in interference, but now a proposed new technology called GapSense avoids collisions among signals: R. Colin Johnson @NextGenLog
Further Reading

Wednesday, April 03, 2013

#WIRELESS: "Facebook Home Replaces Lock Screen"

Facebook has released a suite of apps dubbed "Facebook Home" which takes over the lock screen of any Android device, replacing it with your real-time Facebook newsfeed: R. Colin Johnson @NextGenLog


Facebook Home shows a steady stream of friends’ posts and photos on your lock screen.
Further Reading

Friday, February 22, 2013

#DESIGNWest: "'Lifestyle of Mobility' Book Author to Speak"

In Harald Neidhardt's just-released book Lifestyle of Mobility, a hundred industry movers-and-shakers predict the future of mobile applications. Indeed, Neidhardt declares that the post-PC era is already upon us. Neidhardt has the tech cred to make that statement. He's the founder of MLove, which is both a mobility "lifestyle" Web site and a series of South-by-Southwest-like "ConFestivals."

Mobility apps are being integrated into nearly every consumer field, from health to automotive to games to music to retail and lifestyle electronics.

The mobility tipping point is upon us because current devices now house arrays of MEMS sensors. This opens up possibilities for "empathetic" electronics, which adapt their functions to users and their local environment. According to Neidhardt, the first wave of mobility was borne by the telecommunications giants, from AT&T (U.S.) to NTT (Japan), which built walled gardens around their wireless devices and associated services. The second wave rose as a result of the iPhone, which initiated the app-economy that is also enjoyed today by Google's Android, Amazon's Kindle and Microsoft's Windows Phone along with tablets from the Apple iPad to Samsung's Galaxy Tab. The third wave washing over us now is integrating mobility into every other nook and cranny of electronics by virtue of the inclusion of wireless connectivity and MEMS sensors. Connected homes, connected automobiles ,and connected tools of every type are leveraging ubiquitous sensors and processors to add smarts to everything we do. Thus the smartphone is becoming the remote control of our lives by virtue of apps that use its touchscreen as their human interface.
Further Reading

Wednesday, February 06, 2013

#WIRELESS: "Smartphones, Tablets in Everybody's Future"

Apple sold almost 48 million iPhones in the fourth quarter of 2012 alone, but ABI Research claims that the total installed base of 45 million Windows Phones and 20 million Blackberry-10s is still enough to interest software app developers in supporting them. The total installed base of smartphones worldwide will be 1.4 billion by the end of 2013 with 57 percent running Android and 21 percent iOS; whereas there will be 268 million tablets total--62 percent using iOS and 28 percent Android. Annual growth for smartphones will be 44 percent and a whopping 125 percent for tablets, all according to ABI Research (Oyster Bay, N.Y.): R. Colin Johnson @NextGenLog

ABI’s Mobile Application Technologies Research Service takes a deep dive into the technologies enabling "transformative" applications.SOURCE: ABI Research
Further Reading

Tuesday, December 11, 2012

#CHIPS: "Intel's Atom Extends Mobile Battery Life"

Intel is still the number one chip maker worldwide, but not for long if trends keep pushing new users to smartphones and tablets instead of traditional PCs and laptops, since most of these mobile devices use ARM cores. The tide may turn in 2013, however, if Intel can deliver on the ultra-low-power Atom processor it unveiled today at IEDM: R. Colin Johnson @NextGenLog

Intel's FinFET transistors use three-dimensional (3-D) fins to increase the surface are of its gates, thus lowering leakage and increasing field strength for lower voltage power supplies--both of which boost battery lifetime for mobile devices.

Here is what GoParallel says about Intel's Atom: Intel is aiming to upgrade its Atom processor for the biggest growth areas were in mobile chips. The new low-power process for its mobile Atom processors was described at the International Electron Devices Meeting (IEDM 2012, San Francisco, Dec. 10-11). The new ultra-low-power Atom will extend the battery life of smartphones, tablets, netbooks, embedded systems and other wireless devices, according to Intel...
Further Reading

Friday, October 26, 2012

#WIRELESS: "Telit's M2M Adopts LTE at 100Mbps"

The machine-to-machine (M2M) communications market got a boost to 100-Mbits per second by virtue of Telit's new LTE-based cellular modem technology: R. Colin Johnson


Here is what Telit says about its new 100Mbps M2M modem: Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced the introduction of the LE920 LTE module for European and North American OEM automotive and aftermarket segments. The new 920 form factor measures 34x40x2.8mm on a 198-pad LGA automotive-grade package. The product delivers 100Mbps-down and 50Mbps-up data rates on LTE networks and is fully fallback compatible with DC-HSPA+ delivering up to 42Mbs-down and 5.76Mbps-up where available. Quad-band GSM/GPRS and EDGE performance ensure the module connects even in remote areas devoid of 3G or 4G coverage. Equipped with a high performance multi-constellation GPS plus GLONASS receiver, the LE920 module provides superior navigation coverage even in harsh environments and challenging urban canyons with fast and accurate position fixes, making it ideally suited for full-featured integrated navigation systems and location based services delivered through the car’s infotainment system.

Telit’s LE920 includes distinguishing features such as Rx diversity which allows the end-device to be equipped with two distinct cellular antennas improving the quality and reliability of the wireless connectivity in urban areas, undergrounds, and other similar scenarios, making the product ideal for applications such as an in-vehicle hot-spot. Fully voice capable, the LE920 provides full-duplex PCM as well as analog input and output for applications such as a hands-free in-car cellular functionality, fleet management and other vehicle voice gateway applications. For easy integration, the product includes a USB 2.0 high-speed port and device drivers for most Windows and Linux platforms, and will be available in local variants as required for all major LTE carriers and partner networks in North America and Europe.

The LE920 was designed to meet the most current specifications for the European eCall and Russian ERA-Glonass programs. Mandated by the European Commission, all new cars must have an eCall automatic emergency in-vehicle call system installed by 2015. The system is designed to enhance quality and speed of rescue operations in automotive accident response efforts. In case of a crash, the eCall system transfers the necessary accident data to the nearest emergency service response center expediting life saving measures. ERA-Glonass was designed to be compatible with the European eCall standard. The objective of the program is to combine mobile communications and satellite positioning providing for faster assistance in case of automotive collisions. Its infrastructure is planned to be installed in 2013 with systems mandated in all vehicles in 2014. North America has no similar program.

“The LE920 is Telit’s new high-performance automotive product which also introduces to the market our new form-factor for this segment. One which provides our R&D and product management teams with lots of space for future integration of new and valuable features and resources for our automotive customers,” said Dominikus Hierl, chief marketing officer at Telit Wireless Solutions. “With the LE920’s comprehensive and industry-leading LTE multi-band support, the connected vehicle can provide passengers the same comfort and convenience in terms of internet and information access just as they would enjoy at the home or office - with no compromise in performance.”

As the LE920 was conceived specifically for the automotive market, it boasts an extended temperature range, operating from -40°C to +85°C, designed and manufactured under the strict automotive quality standards specified in the ISO/TS16949. Additionally, materials, facilities, and processes applied on the LE920 also comply with Production Part Approval Process or PPAP, a full traceability framework standard adopted by the automotive industry which among other things allows defective parts to be traced back in its full genealogy up the supply chain.

Industry’s only pure-play m2m, Telit creates value by partnering with customers to provide expert guidance and support from concept development through to manufacturing quickly bringing ideas to market in all application areas including the new “smart” space. With service enhanced products in cellular, short-range, and satellite-navigation easily bundled through high-level software interfaces, Telit-powered m2m devices cost less to integrate, maintain, operate, and update with lower price points for bundled products and savings translating into competitive advantage at the time of sale and throughout the operating life of the customer device.
Further Reading