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Thursday, April 05, 2012

#MEMS: "STMicroelectronics Widens MEMS Lead Thanks to Apple"

The most popular micro-electro-mechanical system (MEMS) maker in the world widened its lead by leveraging its design wins with Apples iPhone, iPod Touch and iPad, accoring to IHS iSuppli.



Fueled by booming sales to Apple Inc., particularly its exclusive design wins in the iPhone, iPad and iPod lines, STMicroelectronics in 2011 padded its leadership position in the global market for microelectromechanical systems (MEMS) in consumer and mobile devices.

STMicroelectronics in 2011 achieved an 81 percent increase in consumer and mobile MEMS revenue to reach $638.7 million, up from $353.3 million in 2010, according to the IHS iSuppli MEMS & Sensors Service at information and analytics provider IHS (NYSE: IHS). This represented the highest level of growth among the top 10 suppliers of consumer and mobile MEMS, allowing STMicroelectronics to increase its market share and leadership margin over No. 2 ranked Knowles Electronics, as presented in the table attached.

French-Italian based STMicroelectronics in 2011 maintained its status as the top supplier with a 30 percent share of the overall consumer and mobile MEMS market, up from 22 percent in 2010.

Early MEMS investment pays off for STMicroelectronics
No. 1 since 2009, STMicroelectronics is the top supplier of accelerometers to cellphones, tablets, laptops and video game consoles, with the accelerometer’s function serving as a motion sensor. STMicroelectronics is also the only provider of accelerometers and gyroscopes—which help improve the motion-based interface of devices—for Apple’s iPhones, iPads and iPods. Apple alone accounted for half of STMicroelectronics’ MEMS revenue in 2011.

Part of STMicroelectronics’ success also stems from the company’s willingness to cooperate with other MEMS companies to shorten time to market, instead of trying to do everything alone. For instance, STMicroelectronics partnered with Honeywell in the electronic compass business, and also collaborated with Omron on MEMS microphones.
STMicroelectronics last year shipped an estimated 15 million digital MEMS microphones into handsets made by Nokia Corp., as well as into laptops from Hewlett-Packard and Taiwanese computer maker Asustek Computer Inc. In the process, STMicroelectronics became the top MEMS microphone supplier to Nokia ahead of former front-runner Knowles, achieving the feat in less than one year.

Top MEMS makers prosper in 2011
The Top 10 suppliers of MEMS devices for consumer and mobile applications accounted for a staggering 86 percent of the market’s overall revenue in 2011. All told, the Top 10 companies collectively generated some $1.9 billion out of a total revenue intake of $2.2 billion for consumer and mobile MEMS.

Consumer and mobile represents the most dynamic and largest MEMS segment, encompassing items like smartphones and media tablets. Combined revenue from the Top 10 this year was up 34 percent from the $1.4 billion generated by the elite circle in 2010.

The rest of the Top 10, as shown in the table, included runner-up Knowles Electronics from Illinois; Texas Instruments from Dallas; Avago Technologies from California; InvenSense, also from California; Bosch of Germany; Oregon- based TriQuint Semiconductor; Japan’s Panasonic Corp.; Kionix Inc. from New York; and Analog Devices Inc. from Massachusetts.

Knowles, TI and InvenSense make gains; Avago drops
Second-ranked Knowles rose one spot from No. 3 in 2010, with MEMS revenue last year up 42 percent to a record $270.9 million. Despite erosion in its market share last year, Knowles still largely dominates the MEMS microphone business with 73 percent share of revenue, remaining highly competitive with a roster of top customers such as Samsung Electronics, Apple and LG Electronics. Knowles also introduced a fourth-generation MEMS microphone last year into the iPhone 4S featuring a 35 percent reduction in silicon area compared to its previous-generation product.
No. 3 Texas Instruments, up a notch from fourth place in 2010, enjoyed consumer and mobile MEMS revenue in 2011 of $204.6 million, a 27 percent increase. Pico projectors are its principal revenue growth driver, as the company’s digital light processing (DLP) technology currently dominates the projector space.

Avago slipped from second place in 2010 to No. 4 last year—one of only two companies alongside Panasonic to decline in ranking among the Top 10. Avago remains the top manufacturer of bulk acoustic wave filters, but price erosion was stronger than unit growth in 2011, causing Avago’s revenue to drop to $190.6 million, down 8 percent from $207.3 million in 2010.

Rounding out the Top 5 last year was InvenSense with revenue of $142.8 million, up 54 percent from the year earlier. While STMicroelectronics was the sole supplier of 3-axis gyroscopes for Apple, InvenSense dominates the 3-axis gyroscope market for other original equipment manufacturers excluding Apple. InvenSense also ships dual-axis gyroscopes into sectors like gaming, and has achieved some success with single-axis gyroscopes for toy helicopters and other consumer goods. The company has managed to reverse its heavy dependence on gaming, diversifying into mobile handsets and tablets last year.
Further Reading

Friday, July 13, 2012

#MEMS: "Gravity Sensors to be Self-Calibrating"

Future gravity sensors will make possible altimeters without barometric pressure sensors, by using 10-times more sensitive micro-electro-mechanical systems (MEMS) that are self-calibrating. MEMS devices usually have to be calibrated at the factory, to insure that they respond in precisely the same way as all the other chips of the same type. But now an accurate, precise, and repeatable self-calibrating technique has been demonstrated that measures planar gaps with a comb drive, but which could also measure other properties such as displacement, force, stiffness or mass with 10-times more precision--enough to create gravity meters that measure your precise distance from the center of the Earth: R. Colin Johnson



With self-calibrating MEMS an on-chip or off-chip electrical probe applies enough voltage to close two unequal gaps with a comb drive while measuring the resulting changes in capacitance. (Purdue University Birck Nanotechnology Center image/Jason Vaughn Clark)

Here is what Purdue says about self-calibrating MEMS: Researchers have demonstrated tiny machines that could make possible super-accurate sensors and motors, with far-reaching applications from computer storage to altimeters, detecting petroleum deposits to measuring DNA-binding forces.

The machines are called self-calibratable micro-electromechanical systems, or MEMS. Although MEMS are in commercial use, the new device is the first of its kind capable of self-calibration, a step critical for applications requiring high performance and accuracy, said Jason Vaughn Clark, an assistant professor of electrical and computer engineering and mechanical engineering at Purdue University.

"Self-calibration is needed because each MEMS device is slightly different due to variations that occur in manufacturing," he said. "Small variations in microstructure geometry, stiffness, and mass can significantly affect performance. Because of this variability, no two MEMS behave identically. Since conventional methods to measure MEMS properties are usually impractical, expensive, have unknown accuracy and large uncertainty, enabling MEMS to calibrate themselves is a game-changing innovation."

Clark previously developed the self-calibration theory. He and doctoral student Fengyuan Li have now created the device and conducted experiments to validate the theory. Findings are detailed in a paper to appear later this year in the IEEE Journal of Microelectromechanical Systems, or JMEMS.

The peer-reviewed work received a grade of A for "innovation" and an A for "importance to the field," which testifies to the significance of the research, Clark said.

"I think it's important to note that in 1990 MEMS pioneer Richard Muller said research on the mechanical properties of the materials in these devices is needed to provide the engineering base that will make it possible to exploit fully this technology," he said. "And during a 2007 visit to Purdue, physics Nobel laureate John Hall said that without accurate and precise measurements, no reliable form of science or engineering is possible."

The self-calibrating technology makes it possible to accurately measure displacement, or how far a measuring device moves, on a scale of micrometers to less than a nanometer - a range that spans a fraction of the diameter of a human hair to a fraction of the width of an atom.

"The difficulty in accurately measuring small displacements represents a bottleneck in MEMS and nanotech advancements," Clark said. "Accurate metrology is a problem that has eluded researchers since the beginning of MEMS and nanotech in the late 1980s. Displacement is fundamental to science and engineering. We know that quantities like velocity, acceleration, force, stiffness, frequency, and mass can be related to displacement. Now, using a $15 chip that can fit on your fingertip, we showed that our technology is able to measure MEMS displacements better than a $500,000 electron microscope."

Introducing accurate measurement methods made the difference between alchemy and chemistry about 230 years ago, and self-calibrating MEMS might bring a similar transformation in the world if nanotechnology, he said.

"The ability to perform accurate measurements is of paramount importance to technological advancement," he said. "In the late 1700s, Antoine Lavoisier transformed alchemy to chemistry by introducing quantitative measurements. Today, some compare the state of micro and nanotechnology to alchemy, where nanotechnologists can precisely sense small signals, but they have not had a practical way to accurately measure most mechanical quantities. That is, no two nanotechnology labs have been able to show that they can measure the same phenomenon and obtain the same numerical result."

The heart of the self-calibrating MEMS are two gaps of differing size, electrostatic sensors and tiny actuators called comb drives, so named because they contain meshing comb-like fingers. These meshing fingers are drawn toward each other when a voltage is applied and return to their original position when the voltage is turned off. The comb drives measure the change in an electrical property called capacitance while gauging the distances of the two gaps built into the device. The fine measurements reveal the difference between the device's designed layout and the actual dimensions.

"Once you learn the difference between layout and fabrication, you have calibrated the device," Clark said. "Many MEMS designs with comb drives can be easily modified to implement our technology. Our research results suggest the days of inaccurate micro and nano-mechanical measurements are numbered."

MEMS accelerometers and gyroscopes currently are being used commercially in products such as the Nintendo Wii video game, iPhone, automobiles, the Segway human transporter and walking robots. However, those MEMS don't require ultrahigh accuracy like those used in tactical- and navigation-grade inertial sensors, which must undergo a complex calibration procedure in the factory. The chips are tested using machines that translate, rotate, shock, and heat the devices.

"The new self-calibratable MEMS could eliminate or reduce the need for rigorous factory calibration, cutting manufacturing costs," Clark said. "Something like 30 percent of manufacturing costs are related to calibration."

The self-calibratable MEMS could lead to high-performance data storage technologies and advanced lithography to create next generation computer circuits and nanodevices.

Researchers will use the new self-calibration approach to improve the accuracy of atomic force microscopes, or AFMs, which are tools essential for nanotechnologists. Purdue operates about 30 AFMs, and Clark's research group will use the calibrated MEMS to calibrate AFM displacement, stiffness, and force.

The group also will use a calibrated MEMS to measure the difference in gravity between different heights above the ground. The ability to measure gravity with such sensitivity could be used as a new tool for detecting underground petroleum deposits.

"Conventional gravity meters can cost over $200,000," Clark said. "They consist of a large vacuum tube and a mirrored mass. Gravitational acceleration is determined by measuring the drop time of the mass in free fall. Since oil or mineral deposits have a different density than surrounding material, the local gravity is slightly different."

The bulky and expensive gravity meters could be replaced with a small and inexpensive MEMS chip. Another potential application is as an altimeter for aircraft. Conventional altimeters measure height by using air pressure, which fluctuates.

"These altimeters aren't really accurate," Clark said. "Having a sensor that could accurately determine height would be an asset while flying at night, through fog, or bad weather.

The self-calibratable technology also could allow MEMS to recalibrate themselves after being exposed to harsh temperature changes or remaining dormant for long periods.

Yet another potential application is the study of exotic phenomena such as forces between molecules and within tiny structures on the scale of nanometers.

"A more accurate MEMS device could make it possible to measure physical phenomena that have been beyond the resolution of conventional technology," Clark said. "To fully understand and exploit the attributes of the nanoscale, you really have to be able to accurately measure subtle phenomena. Without accurate measurement tools, it becomes difficult to discover or resolve these phenomena, to develop accurate physical models, and to subsequently use the models to explore possibilities leading to useful innovations."

The work is based at the Birck Nanotechnology Center in Purdue's Discovery Park. The research is funded by the National Science Foundation.
Further Reading

Tuesday, September 07, 2010

Cell Phone Antenna Woes Cured by Radio Frequency RF#MEMS

RF-MEMS uses tiny mechanical switches, filters and other radio frequency front-end replacements that can be dynamically tuned in realtime to compensate for mobile user reception woes causes by antenna interference. Look for improved reception for #Apple #iPhone and other #smartphone models adding RF-MEMS chips in 2011 creating a quarter-billion dollar market by 2014. RColinJohnson @NextGenLog


The iSuppli global market revenue forecast for RF MEMS switches and varactors from 2006 to 2014.

Here is what iSuppli says about RF-MEMS: Help may be on the way for iPhone 4 users frustrated by dropped calls with the arrival of Radio Frequency Microelectromechanical Systems (RF MEMS), semiconductors that can improve the performance of antennas in cell phones...Long plagued by technological hurdles and other disappointing setbacks, RF MEMS are finally ready for the big time, with revenue projected to double in 2010 and more than triple in 2011. From slightly less than $4 million in 2006, global RF MEMS revenue is anticipated to climb to $8.1 million this year—and then surge to $27.9 million in 2011...By 2014, revenue will reach a whopping $223.2 million.



Arrays of tuning capacitors that can by dynamically switched in and out of circuits tune a cell phone's antenna in realtime to improve reception and mitigate dropped calls.

Although other technologies will address antenna issues, including SoS FETs and BST varactors, MEMS deliver the best performance in terms of insertion loss...Seven firms are sampling RF MEMS...California-based WiSpry Inc. and Japan’s TDK-Epcos are offering RF MEMS for high-volume cell phone applications. On another front, U.S. firms Analog Devices Inc., Radant Technologies Inc. and XCOM Wireless Inc.—in cooperation with relay manufacturer Teledyne Technologies Inc.—as well as Japanese supplier Omron Corp. are targeting high-end applications for testing and instrumentation such as ATE and RF test. U.S. startups Radant MEMS and MEMtronics focus on defense applications...In particular, interest is growing among mobile handset manufacturers on how RF MEMS can be used for the front-end tuning of cell phones to improve antenna performance, given the advent of new wireless standards like LTE for 4G technology. WiSpry—which has garnered several design wins for its MEMS varactors...
Full Text: http://bit.ly/NextGenLog-9SK3

Friday, August 21, 2009

"MEMS: Knowles Acoustics ships billionth MEMS microphone"

Knowles Acoustics (Itasca, Ill.) has shipped its one billionth micro-electro-mechanical system (MEMS) microphone, which the company claims makes it the world's largest supplier. Sales of its surface-mount SiSonic MEMS microphone has catapulted Knowles Acoustics into the top MEMS microphone slot as well as placed it in the top five MEMS suppliers for consumer and mobile applications, according to iSuppli Corp. (El Segundo, Calif.) Knowles Acoustics, a supplier of traditional electret microphones, delivered its first MEMS microphone in 2003, two years behind the debut of the world's first MEMS microphone by Akustica Inc. (Pittsburgh). Since then Knowles Acoustics has become the world's largest supplier of MEMS microphones, passing by Akustica who claims to have delivered only five million microphones to date. Akustica was recently acquired by Robert Bosch North America. Knowles manufactures its SiSonic MEMS microphones in its own dedicated 80,000 square foot fab in Suzhou, China, where it currently makes 30 different models of MEMS microphones, which it supplies to makes of mobile phones, laptop computers, gaming systems, and Bluetooth headsets.

Text

Thursday, November 08, 2012

#MEMS: market growth outpacing competitors

Instead of beginning to wane, the exponential growth of MEMS devices is just starting, according to analysts at the MEMS Executive Congress 2012 (Nov. 7-9, Scottsdale, Ariz.), who predict that a dozen new types of MEMS device will keep the market vitalized for the foreseeable future: R. Colin Johnson


News MEMS devices take a decade to mature (right) with the bulk of next-generation MEMS innovations still in the formative stages (left).

Here is what EETimes says about the MEMS market: Micro-electro-mechanical-systems (MEMS) have revolutionized every market in which they have become successful, but the trend is just beginning, according to analysts speaking on a panel at the MEMS Executive Congress 2012 here.

Analysts project rapid growth for the types of MEMS already in widespread use. But, by later this decade, several more types of MEMS devices are expected to be in production, creating more potential for exponential growth.
Further Reading

Wednesday, May 17, 2017

Entries from 2017-2018

NextGenLog: 2017-2018
   
Imec Aims 2-D FETs at Sub-5-nm Node | EE Times
   
TI Claims to Obsolete FPGAs for Embedded Apps | EE Times
   
NIST Backs Quantum-level Temperature Measurement | EE Times
   
ReRAM Goes 3D | EE Times
   
'E-Brain' to Pilot Air Force Jets | EE Times
   
Intel Banks on Artificial Intelligence | EE Times
   
Cray Moves to Lasso 'Big Data Deluge' | EE Times
   
Germanium Displacing GaAs for RF Transistors | EE Times
   
'Supercomputer-as-a-Service' Model is Born | EE Times
   
IBM Optics Go CMOS | EE Times
   
Researchers Print Stretchable Battery to Light Wearables | EE Times
   
GaAs Nanowires Boost Solar | EE Times
   
Is Elon Musk's Brain Cap Viable? | EE Times
   
Cray Rolls Clustered Supercomputers for AI | EE Times
   
Quantum Molecules Compute | EE Times
   
Coventor Touts Unified MEMS Platform | EE Times
   
3-D Graphene Boosts Electronics | EE Times
   
Researchers Create Artificial Synapse For Electronic Brains | EE Times
   
Intel Re-defines Xeons | EE Times
   
DoE Claims 1nm Fab Record | EE Times
   
Single-Pixel Camera Mimics Human Eye | EE Times
   
New Method Cuts Cost of GaAs Circuits | EE Times
   
Smart Semi Fiber Does It All | EE Times
   
Star Trek Tricorder Arrives | EE Times
   
Quantum Photons Emitted | EE Times
   
Researchers Developing Touch Sensitivity for Your Levi's | EE Times
   
IBM Bests Insulators | EE Times
   
ISPD Predicts Chip Futures | EE Times
   
Intel Shows Life Beyond CMOS | EE Times
   
TSMC Joins Chip Research Consortium | EE Times
   
3-D Interactive Projection Redefines MEMS | EE Times
   
Peer-to-peer IBM App Bypasses Carriers | EE Times
   
Atomic-scale Electronics Probed | EE Times
   
Hydrogen Fuel Cells: DOE Finds Faster, Cheaper Catalyst | EE Times
   
Samsung Beats Apple to Punch with MEMS Antenna Tuning Array | EE Times
   
Space X: L.A. to S.F. in 35 Minutes | EE Times
   
Bosch Dev Kit to Ease IoT | EE Times
   
Quantum Computing on Cusp | EE Times
   
Smartphone Senses Anything | EE Times
   
Nanotube Contacts Perfected | EE Times
   
Thinnest Nanowire Self-assembles | EE Times
   
China Returns Navy Sea Drone | EE Times
   
DARPA Funds Small Businesses with Big Ideas | EE Times
   
Software Finds Research for You | EE Times
   
Biometrics Won't Kill Passwords | EE Times
   
Cray Sets Deep Learning Milestone | EE Times
   
Biometrics Ensure Security | EE Times
   
1st Qubits on 300mm CMOS | EE Times
   
Watson IDs Heart Disease | EE Times
   
1st Photonic Circuits Here | EE Times
   
Photonics 3-D Modeler Born | EE Times
   
Smartphone-Bound VR/AR to Be Boosted by Lasers | EE Times
   
3D Printed Buses Here | EE Times
   
AT&T: SIMs are Key to IoT Future | EE Times
   
Coating Stops Exploding Batteries | EE Times
   
IEEE Sensor 2016 Exhibits MEMS | EE Times
   
DARPA's N-Zero Sensors Use 0 Power | EE Times
   
Watson Wins GM | EE Times
   
Watson Use Proliferating | EE Times
   
U.S. Protecting Us from AI | EE Times
   
4DS Memristors Target ReRAMs | EE Times
   
Oxygen Layer May Extend Moore's Law | EE Times
   
Nobel Prize: Why Superconductivity? | EE Times
   
Software Predicts Power Component Failure | EE Times
   
Biometrics May Replace Phone Passwords | EE Times
   
Universal Memristor Models All | EE Times
   
5G Powered by MEMS | EE Times
   
Transistor Trick Beats Moore | EE Times
   
Biometrics Upgrade to AirPod-like Earbuds | EE Times
   
SGI Supercomputes Ireland | EE Times
   
IoT 3 in 1 Tape Measure Get Crowdfunding Love | EE Times
   
Indoor Nav Leverages LTE | EE Times
   
Ford / MIT Collaborate on Future | EE Times
   
Advances Get a Grip on Single Photons & Molecules | EE Times
   
Watson for the Masses | EE Times
   
E-Retailers Automate Fulfillment | EE Times
   
EPA Crowdsources Pollution Sensing | EE Times
   
Intel to Acquire Deep Learning Nervana | EE Times
   
IBM Lab on Chip Detects Cancer | EE Times
   
2-D PV to Rival Graphene | EE Times
   
Next-Gen IoT Consortium Launches | EE Times
   
Oxides Make Ultra Conductor | EE Times
   
Spray-On Solar Material Holds Promise | EE Times
   
Cray, Deloitte Don White Hat in Security Service | EE Times
   
Stacking Boosts Polarimetry | EE Times
   
Quantum Superconducting Advance | EE Times
   
Intelligence Agency Sets 3D Challenge | EE Times
   
IBM, Samsung Put New Spin on MRAM | EE Times
   
Co-Robots Tend 3-D Printers | EE Times
   
Intel Xeon Phi Solos | EE Times
   
IBM to Donate Cognitive Analytics/Learning | EE Times
   
DAC: Coventor Adds Electrical Analytics | EE Times
   
Intel's Xeon Tackles Real Time | EE Times
   
Russian Make Diamond MEMS Resonators | EE Times
   
Intel Broadens Xeon Video Offerings | EE Times
   
Ultra-Dense 3-D Packaging for IoT | EE Times
   
NXP Aims to Target IoT | EE Times
   
NXP Focuses on Smart Cities, Security in Keynote | EE Times
   
IoT Security: Taming a Perfect Storm | EE Times
   
Magnetic Graphene Possible | EE Times
   
Diamond ICs May Finally Debut | EE Times
   
Analog Brain to Simulate Real Thing | EE Times
   
Graphene Patterned at Room Temp | EE Times
   
MIT: Changing Coal into Circuitry | EE Times
   
Harvest Electricity from Magnetism | EE Times
   
Cutting Antenna Design Time | EE Times
   
Russia, U.S. Get Closer to Universal Memory | EE Times
   
Quantum Dots Boost Solar Cells | EE Times
   
CMOS Circulator Chip Enables Single Antenna | EE Times
   
Can Einstein Be Wrong About Naked Singularities? | EE Times
   
Superconductor Nearing Room Temp | EE Times
   
IBM Neurocomputer Detailed | EE Times
   
Intel Plans A Future of CMOS | EE Times
   
Intel's Xeon E5 in the Clouds | EE Times
   
NeuroComputer to Shepherd Nukes | EE Times
   
Ultrasonic LCDs Sans ITO | EE Times
   
Top Robots for Farmers for 2016 | EE Times
   
Concept of Superconducting Memory To Be Tested | EE Times
   
Google Divesting Humanoid Robots | EE Times
   
Last MEMS Oscillator Maker Standing | EE Times
   
MEMS Grand Challenge Debuts | EE Times
   
Leti Solves Silicon Resonator Mystery | EE Times
   
Quantum Computers Crack Public-Key Encryption | EE Times
   
Decoding Electronic Materials Genome | EE Times
   
MRAM Breakthrough Looms | EE Times
   
E.U. Tackles III-V on CMOS | EE Times
   
Engineers Week Turns 65 | EE Times
   
Watson XPrize Worth $5 Million | EE Times
   
IBM CEO: Reinventing IBM's Profit Stream | EE Times
   
IBM Claims Tamper-Resistant Server | EE Times
   
DARPA to Remake Itself Leaner | EE Times
   
Transistors Minus Semiconductors | EE Times
   
Cavendish MEMS Displace SOI | EE Times
   
Taiwan Pursues White LED | EE Times
   
Robots Get A Gentler Grip | EE Times
   
Russians' Report Memristors | EE Times
   
Artificial Intelligence Pioneer Marvin Minsky Dead at 88 | EE Times
   
Cardboard Energy Harvester | EE Times
   
IoT Shoots for the Stars | EE Times
   
Memristor Computer Emulates Brain Functions | EE Times
   
Intel Thwarts Hackers | EE Times
   
Little Pharm Born | EE Times
   
Imec Melds Flash/III-V | EE Times
   
Micron 3-D NAND Back to Moore | EE Times
   
MediaTek 5G Combines Heterogenous Dark Silicon | EE Times
   
CES: ASIC Enables Location Services | EE Times
   
TSensors to Predict Natural Disasters | EE Times
   
Intel Funds Doctor in Your Pocket | EE Times
   
DARPA Funds Atoms-to-Products Breakthrough | EE Times
   
Skin Cancer Biopsied by Optical Scan | EE Times
   
Co-Robots: Taiwanese Style | EE Times
   
Roadmap to Trillion Sensors Forks | EE Times
   
One-Transistor SRAM Stuffs More Into CMOS | EE Times
   
IBM Forecaster Cuts Pollution, Energy Waste | EE Times
   
Tech & Climate: Stanford's Grand, Green Plan | EE Times
   
Tech Tackles Climate Change: Wind & Will Power | EE Times
   
2016: Year of the Nanotube Transistor? | EE Times
   
Technology Tackling Climate Change | EE Times
   
MEMS Market: Ups and Upstarts | EE Times
   
TrulySecure Embeds Biometrics | EE Times
   
Menta eFPGAs Win Over E.U. | EE Times
   
Intel Scales System Framework | EE Times
   
Chinese Spending All-Out on HPCs | EE Times
   
MEMS for Million-Dollar Horses | EE Times
   
Write-Once Memory Speeds Up, Powers Down Reads | EE Times
   
Micron Persistent Memory Pairs RAM/Flash | EE Times
   
Oculus Originator Gives Away MEMS Version | EE Times
   
Audio Digital Signal Processing Without the Experts | EE Times
   
Slideshow: BMW's Hybrid EVs | EE Times
   
IBM's Watson Tackles Sports | EE Times
   
Mentor Graphics Speeds Ethernet Verification | EE Times
   
Saxony Leads Germany's Semis | EE Times
   
IBM Flash Downtime 30-Seconds per Year | EE Times
   
Silicon on Insulator Penetrates Apple/Intel/IBM | EE Times
   
Organics To Extend Moore's Law | EE Times
   
5G for Command & Control | EE Times
   
Put FPGAs In Your SoCs | EE Times
   
IBM Nanotubes May Redefine Future of Moore's Law | EE Times
   
ASICs Memory Bandwidth Issue Fix Offered | EE Times
   
3D Memory Chips May Beat 3D Hybrid Memory Cube | EE Times
   
Watson-Type Machine Learning Affordable for Small Business | EE Times
   
MotionEngine Wear Debuts | EE Times
   
Solar Cells Made Obsolete | EE Times
   
VW's Woes Could be Solved by Tailpipe Add-on | EE Times
   
3-D Invisibility Guaranteed | EE Times
   
Will Semiconductors Last Forever? | EE Times
   
NIST Hits Quantum Teleport Key Out of the Park | EE Times
   
3D Printed Parts Help Regenerate Nerves | EE Times
   
Google Unveils Project Aura | EE Times
   
NASA Robots Proliferate | EE Times
   
Glasses Foil Facial Recognition | News | Communications of the ACM
   
Superconducting Graphene Beckons | EE Times
   
Philips' Home Medicine Connects to Medical Records | EE Times
   
Software Regulates Voltage in Everyday APUs | EE Times
   
Smart Prosthetics to Learn Mind Reading | EE Times
   
Post-Silicon Tech Compared | EE Times
   
Green Gaming is Possible | EE Times
   
IBM mbed with ARM | EE Times
   
LED Displays Get Wearable | EE Times
   
SiC/GaN Poised for Power | EE Times
   
LEDs Get As Cheap as Bulbs | EE Times
   
'Future Frontier' Sees Drones, Space | EE Times
   
Intel's Open-Source Fabric Supersizes Comm for Data | EE Times
   
Fabless RF Filters Cut Size, Share Same Die | EE Times
   
iPhone6 Powered by Hydrogen | EE Times
   
Quantum Highway Frictionless | EE Times
   
5G the Free WiFi Killer | EE Times
   
Plastic Solar Cells Double Output | EE Times
   
Metamaterials Single-Out One Voice | EE Times
   
Graphene Ribbons Grow on Germanium | EE Times
   
RRAM Breaks Records with Graphene | EE Times
   
IBM Watson Ready for Kick Off | EE Times
   
'Black Dart' Counters Drones | EE Times
   
3D Cursors Sculpt at Siggraph | EE Times
   
Solar Cell, Battery Combo May Simplify Power Generation | EE Times
   
Intel's Skylake Debuts at Gamecon | EE Times
   
Semiconductor-less Transistors the Goal | EE Times
   
Terahertz Optical Transistors Beat Silicon | EE Times
   
NASA Preps Venus ICs | EE Times
   
Hybrid Solar Cells Capture More | EE Times
   
Smarter Sensor Hub Cuts Power | EE Times
   
Quantum Computing: Diode-like Breakthrough Surmounts Roadblock | EE Times
   
Nanoparticle Imaging with Graphene | EE Times
   
007 Movie Inspires Concept Cars | EE Times
   
IBM Frees Open Source Apps | EE Times
   
3D Printed Electronics Are Here, Researchers Say | EE Times
   
IBM Slashes Next-Gen Power | EE Times
   
Top 10 Supercomputers in View | EE Times
   
Intel Showcases Its Supercomputing Future at ISC | EE Times
   
Supercomputing Centers-of-Excellence Twin | EE Times
   
IBM Leapfrogs Intel to 7nm | EE Times
   
Self/less Sheds Electronic Brain | EE Times
   
Startup Beats HP, Hynix to Memristor Learning | EE Times
   
Thin Film Solar Cells May Rival Silicon | EE Times
   
FinFETs + FD-SOI Proposition: May Save Power | EE Times
   
Biodegradable Electronics Debut | EE Times
   
Somnium Soups Up Kinetis Code | EE Times
   
Automotive King Redefines Future | EE Times
   
Woz Wows with Humanitarianism | EE Times
   
Freescale S32 Ups Automotive Ante | EE Times
   
'Smallest SoC for IoT' Adds Memory | EE Times
   
Freescale i.MX 7 Finally Here | EE Times
   
IBM Demos III-V FinFETs on Silicon | EE Times
   
Wearables Get Their Own MEMS | EE Times
   
Fairchild Out Smarts Dumb MEMS | EE Times
   
IBM Sparks Machine Learning | EE Times
   
TI Offers Wearable Evaluation Kit | EE Times
   
Tiny Spirals May Make Counterfeiting Impossible | EE Times
   
IBM Demos III-V on Silicon | EE Times
   
Free Service Compares Devices | EE Times
   
IBM Renting Its EDA Tools | EE Times
   
Nanoscale Sensor Breakthrough May Lower Costs | EE Times
   
City Smarts Marshalled in Germany | EE Times
   
Intel Unveils Cores and Xeons | EE Times
   
Industry's Most Sensitive MEMS Mic | EE Times
   
Can Formula E Overtake Formula One? | EE Times
   
Gaming Helps Tool Emulate True Power Peaks | EE Times
   
Smart Factories Meet AI | EE Times
   
Self-Driving Cars Without Passengers | EE Times
   
Festo's Smart Robotics Aimed at SMC | EE Times
   
IBM Demos CMOS Silicon Photonics | EE Times
   
Samsung Breaks Ground on $14 Billion Fab | EE Times
   
Intel's High-End Xeon E7v3 Debuts | EE Times
   
Living Computers Ultimate Goal | EE Times
   
Start-up's Co-Robots Handle Logistics | EE Times
   
IBM Solves Quantum Computing | EE Times
   
Ruggedized Tire Pressure Sensor Raises Bar | EE Times
   
Elvis Sees All in Russia | EE Times
   
TI Obsoletes FPGA | EE Times
   
Aluminum Battery Recharges in 1sec | EE Times
   
Moore's Law: Dead or Alive | EE Times
   
IBM vs. Intel in Supercomputer Bout | EE Times
   
3D Testing Standardized by SRC | EE Times
   
IBM Sets Memory Density Record | EE Times
   
Sensor Hub Lowers the Power | EE Times
   
Nanotube Circuits Learn Functions | EE Times
   
Vote Today! Best Nanotech | EE Times
   
Bell Labs Opens New Doors | EE Times
   
Mentor Graphics Drives ISPD Contest | EE Times
   
CoolCube 3D Goes Monolithic | EE Times
   
Analog EDA Finally Automated | EE Times
   
3D Qualcomm SoCs by 2016 | EE Times
   
Researchers Claim 44x Power Cuts | EE Times
   
Robotic Bacteria Senses Humidity | EE Times
   
Nanolaser Enables On-Chip Photonics | EE Times
   
SynBio Stubs for Standards | EE Times
   
Intel's Xeon Phi to House 72-Cores | EE Times
   
Optical Color Shifter Computes Cognitively | EE Times
   
Bi-directional RF Doubles Cellular Capacity | EE Times
   
Insects Harnessed for Surveillance | EE Times
   
Scientists Pursue Super-Fast Material | EE Times
   
Tri-Core Sensor Hub Ups Ante: Sensors Included | EE Times
   
Free Sirius One-Ups Siri | EE Times
   
Heart On-A-Chip Beats | EE Times
   
Intel's 1st Xeon SoC Twists ARM | EE Times
   
Bosch Debuts 1st MEMS Sensor Hub | EE Times
   
IBM's Watson Does Deep-Learning Too | EE Times
   
2D Material Beats Graphene | EE Times
   
3D Printing Everywhere from Lab to Factory | EE Times
   
Graphene Polymer Speeds Electron Transport | EE Times
   
Hi-Speed Transistors from Liquid Processing | EE Times
   
Flash for Even Commodity Servers | EE Times
   
3D E-Beam Enables 3D NAND Flash | EE Times
   
Quantum Transistor Harnesses New Effect | EE Times
   
Microsoft, Google Beat Humans at Image Recognition | EE Times
   
IBM Adds All Vendors to its Cloud-of-Clouds | EE Times
   
CMOS Image Sensors Surpassing Moore's Law | EE Times
   
Out Googling Google on Big Data Searches | EE Times
   
Thermoelectric Nanowires to Cool Chips | EE Times
   
Invisibility Cloaks Now Shield People from Sight | EE Times
   
2nd TransAsia To Crash in a Year | EE Times
   
GE's Open-Source Smart Refrigerator | EE Times
   
Supercapbatteries, Thermoelectrics to Power Future Cars | EE Times
   
Intel 5th Gen vPro Goes 60GHz Wireless | EE Times
   
Quantum Entanglement Now On-a-Chip | EE Times
   
Co-Robots Working Alongside People | EE Times
   
Intel, Microsoft, Autodesk Creating Life | EE Times
   
$2 Waves 3D Gesture Into Any Device | EE Times
   
Drones and Wearables App Store Launches | EE Times
   
Ford Self-Driving Cars On-the-Cheap | EE Times
   
Electronic Spine Cures Paralysis | EE Times
   
CES 2015: Ultra-High-Definition 4K TV over Copper | EE Times
   
CES 2015: MEMS that Wearables/IoT Need | EE Times
   
CES: IoT Modules Quicken Innovation | EE Times
   
Bosch Awash in MEMS Combo Sensors | EE Times
   
Sony Chooses PNI Hub for SmartWatch | EE Times
   
CES: 55 TV Thin as iPad Air | EE Times
   
CES: 2 Displays on Russian Yota Smartphone | EE Times
   
Electric/Hybrid Aircraft Takes Flight | EE Times
   
MEMS Spurred by Industrial IoT | EE Times
   
Researchers Superconduct at 140 Degrees | EE Times
   
Spray Solar Cells on Any Surface | EE Times
   
True 3-D Chips Harness Nanotubes | EE Times
   
MIT Discovers Superconductor Law | EE Times
   
Superconductor Unveils Room Temp Future | EE Times
   
DARPA Offers Free Watson-Like Artificial Intelligence | EE Times
   
MIT Spinoff Funded $143M to Create Sentient Computers | EE Times
   
TI's Digital Light Processor Shrinks to Glasses Size | EE Times
   
Biologists Grow Living Circuits | EE Times
   
Moore's Law Competitor Wins $150K Elevator Pitch Prize | EE Times
   
Stephen Hawking: How He Speaks & Spells | EE Times
   
Carbon Nanobuds Flex, Replace Indium Tin Oxide | EE Times
   
Flexible OLEDs Clear Last Hurdle | EE Times
   
ST's Small 6-Axis IMU a Big Move Into Automotive | EE Times
   
Superconductivity Predicted by Supercomputer | EE Times
   
3D Prints World's Best Inverter | EE Times
   
Lucio Lanza to Receive EDA Honor | EE Times
   
Nanotube Field Emitters Beat OLEDs | EE Times
   
First 2D Atomic Piezoelectric Discovered | EE Times
   
Intel, IBM Dueling 14nm FinFETS | EE Times
   
World's Wireless Record Breaks 40 Gbit/s | EE Times
   
China's 5-Year Plan Revealed | EE Times
   
River Sensors to Clean Up Waterways | EE Times
   
IBM's Watson Going Global | EE Times
   
Cheap Fusion Beats Fossil Fuels | EE Times
   
Why Do Big Companies Make Their Own Sensors? | EE Times
   
$200M Photonics Effort to Keep US Ahead | EE Times
   
Electronic Brain by 2023 | EE Times
   
IBM Water Cooling Enables a Super Solar Dish | EE Times
   
Fairchild Reinvents Itself | EE Times
   
Google Glass & Lookalikes Find Niches | EE Times
   
Moore's Law Has No End in Sight | EE Times
   
Intel Xeon Boosts Workstation & Servers | EE Times
   
Samsung Funds III-V FinFETs in US Lab | EE Times
   
Always-On Touch Gestures Save Time & Battery | EE Times
   
Indoor Navigation: The Next Big Thing | EE Times
   
Free Process Design Kit Hits 15nm | EE Times
   
The Limits of Moore's Law Limits | EE Times
   
MIT Wrist-Robot Adds Extra Fingers | EE Times
   
Cloud-Based Chip Design Research & Education | EE Times
   
Energy Harvesting Chip Demonstrated | EE Times
   
Movidius Vision Processing Unit Enters 2nd Generation | EE Times
   
Gadget Uses Brain Waves to Control Household Functions | EE Times
   
IBM Puts Brain On-a-Chip | EE Times
   
Intel Readies Super-Resist for EUV | EE Times
   
Flexible Displays Going Commercial | EE Times
   
Bell Labs Hits 10 Gbit/s Broadband Over Copper | EE Times
   
Invensense MEMS Merges With Movea Motion | EE Times
   
MIT Puts 36-Core Internet on a Chip | EE Times
   
Lowest Power MEMS Mic Cuts Noise | EE Times
   
IBM Pledges Nanotube Transistor by 2020 or Bust | EE Times
   
Top 10 Supercomputers Worldwide | EE Times
   
Monolythic MEMS Sensor Cut Size/Cost | EE Times
   
Intel Massive Parallel Upgrades Due | EE Times
   
MEMS Microphones Busting Out All Over | EE Times
   
Micron 3D Memory Supercharges Xeon Phi | EE Times
   
First Ultrasonic MEMS Controller to Make Mobile Hands Free | EE Times
   
Conductive Polymer Beats Indium Tin Oxide by 10x | EE Times
   
Movidius Redefines Computer Vision | EE Times
   
Intel & Georgia Tech Advance Spintronics | EE Times
   
MEMS Clock Cuts Wearable Power in Half | EE Times
   
SpaceX 3D Prints Rocket Thruster | EE Times
   
Supercaps Breakthrough: Phone Case to Replace Battery | EE Times
   
Cyborg-Like Bionics Harness Sunlight | EE Times
   
IBM Sets World Record With Mag Tape | EE Times
   
Novel, Inexpensive 3D Chips Funded by SRC | EE Times
   
Neurogrid's Electronic Brain Controls Robotics | EE Times
   
Aquifi's Gesture Interface Adapts | EE Times
   
China Takes Lead in Carbon Nanotubes & Graphene | EE Times
   
IBM's 3D Printer to Revolutionize Chip Prototyping | EE Times
   
Ultracapacitor Breakthrough May Recharge Energy Storage | EE Times
   
Cadence to Acquire Jasper | EE Times
   
Archer Supercomputer Is Fastest in UK | EE Times
   
ISPD-14 Focuses on FinFETs, Security, Supply Chain | EE Times
   
NIST Sets New Time Standard | EE Times
   
MEMS Mics Pass $1B Milestone | EE Times
   
GE Claims Fastest, Highest-Power MEMS Switch | EE Times
   
IBM Founds Watson Group | EE Times
   
Mobile Boosts Processor Market | EE Times
   
Stanene May Be Better Than Graphene | EE Times
   
Ink-Jet Printing for OLED Displays Debuts | EE Times
   
Intel to Customize High-End Processors | EE Times
   
IBM Broadens Access to Ask Watson Apps | EE Times
   
5 MEMS Chips Debut at MEMS Exec Congress | EE Times
   
Invisibility Cloak Comes to Life | EE Times
   
Robot Rings Nasdaq Closing Bell | EE Times
   
Samsung Tips $100 Million IoT Strategy | EE Times
   
Allwinner IPO to Fuel Mobile Road Map | EE Times
   
III-V FinFET Fabed on Silicon | EE Times
   
Join Live Chat on Toyota Unintended Acceleration Wed. Nov. 6, 1PM ET | EE Times
   
Graphene Laser to Probe Superconductivity | EE Times
   
Motion Processing for Android KitKat | EE Times
   
Sensor Hubs Arrive for Android | EE Times
   
SK Hynix Licenses BeSang's 3D IC | EE Times
   
Vicarious AI Passes Turing Test | EE Times
   
Wearable Display Goes 1 Step Beyond Google Glass | EE Times