Traditional silicon circuitry is lightning fast, but can't be deposited on flexible polymer substrates because of the high temperatures used to process CMOS wafers. Conversely, silicon inks and organic circuitry can print electronics onto flexible substrates at low temperatures, but their speed is dismal compared to CMOS. Now, researchers claim to have invented a method that combines the best of both worlds--CMOS circuits on flexible substrates--by transferring silicon circuits from a wafer onto the flexible polymer substrate.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=212200102
Audio: http://homepage.mac.com/guitarmedia/interviews/rcjFlex-08-11-24.mp3
