#3D: "Chips On-the-Cheap Funded by SRC"

Stacking memory is just most obvious application of this ultra-cheap method of stacking 3D circuitry within the metallization layers of standard CMOS chips, but I'm sure that when designers put on their thinking cap they'll find many more useful applications.: R. Colin Johnson @NextGenLog

Interferometric TFT printed above an oxide covered (blue) metallization layer of a CMOS chip.

Further Reading