#CHIPS: "Cobalt Encapsulation Extends Moore's Law"

Applied materials thinks is has the solution to copper interconnects becoming unreliable below the 28 nanometer node where they are increasingly subject to voids during manufacturing and electro-migration in the field. The answer--encapsulating copper in cobalt whose excellent wetting prevents voids and encapsulation mitigates electro-migration.

Cobalt encapsulation tool adds two new steps to the copper interconnection process.

Endura Volta CVD encapsulates copper in cobalt to prevent voids and electro-migration.

Further Reading