Seven RF front-end functions can be integrated onto a single CMOS chip using silicon-on-insulator technology, according IBM Corp., which unveiled its CMOS 7RF SOI semiconductor technology Wednesday (Sept. 12). IBM said it would provide the single-chip CMOS solution for RF front ends used in cellphones. RF front-end functions in cellphones are currently handled by five to seven chips, including at least two using expensive gallium arsenide technologies. IBM claims its RF front-end will reduce costs by eliminating the need for GaAs as well as by reducing chip counts in wireless devices. IBM predicts its customers, cellphone chip set makers, will initially utilize its technology to reduce chip counts to two or three chip sets before implementing a single-chip solution.