"CHIPS: ASICs added to MEMS wafers"

Microelectromechanical system (MEMS) chips are currently joined to separate CMOS ASICs after separate wafers are diced. A new technique called "chip-on-MEMS" bonds ASIC dice atop an entire MEMS wafer before dicing, according to developer VTI Technologies Oy.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=202801147