"MATERIALS: Solder made obsolete by growing copper pillars"

Soldering chips to boards may become a thing of the past as a result of research on copper materials sponsored by Semiconductor Research Corp. (SRC, Research Triangle Park, N.C.) at the Georgia Institute of Technology.
Using an electroless plating process, future chips may be attached to circuit boards with copper pillars without solder. The research group has developed a method to turn ordinary copper traces on printed-circuit boards into ultra-high frequency coaxial transmission lines.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=206503050