Thursday, November 06, 2008
Electronic switching of high-frequency signals currently must be handled by either mechanical switches or reed relays. Now, MEMS switches can do the same job in a smaller package, according to Omron Corp. Omron (Shiga, Japan) fabricates its RF MEMS switch using three wafers bonded together before dicing. The bottom wafer contains the electronic input and output traces and the fixed electrodes, the middle has the movable, metallic switch attached to movable electrodes and the top wafer caps the stack in glass to prevent contamination.
Posted by R. Colin Johnson at 9:12 AM