EV Group (EVG), a maker of wafer bonding and lithography equipment for micro-electro0-mechanical systems (MEMS), nanotechnology and traditional semiconductors, claims an uptick in orders of 10 percent compared to this time last year. The rise was attributed by the company to growing demand for through-silicon-via (TSV) equipment for volume manufacturing of 3D chips as well as increasing orders from research institutes, universities and organizations like SEMATECH.
Text: http://www.evgroup.com/en/about/news/56216/
