True 3-D chips build layer upon layer in the fab rather than just stack die. These researchers through in low-temperature nanotube processing to sandwich two RRAM layers between to layers of logic, with more to come: R. Colin Johnson @NextGenLog and EE Times
3-D chips from Stanford connect four layers with standard vias, with the bottom being standard CMOS, the top carbon-nanotube logic transistors, and the middle two layers of resistive random access memory (RRAM).
Cognitive computers—cognizers—aim to instill human-like intelligence into our smartphones, tablets and other electronic devices using microchips that emulate the human brain. Dubbed the “Future of Computing” by the NYTimes, one of the “Best Innovation Moments of 2011” by the Washington Post and one of “10 World Changing Ideas” in a Scientific American cover story “A Computer Chip that Thinks” this book reveals how neuroscience and computer science are merging in a new era of intelligent machines light-years beyond Apple's Siri, IBM's Watson.
Next-generation electronics and technology news stories published non-stop for 20+ years, R. Colin Johnson's unique perspective has prompted coverage of his articles in a diverse range of major media outlets--from the ultra-liberal National Public Radio (NPR) to the ultra-conservative Rush Limbaugh Show.