The world's smallest inertial sensors have already taken China by storm and are poised to take on the rest of us with their software iGyrpo which is affordable by any smartphone or tablet maker: R. Colin Johnson @NextGenLog
mCube says it has the world's smallest three-axis MEMS accelerometer and the only monolithic single-chip version with integrated MEMS and ASIC on the same die. The device is shown here in a 3x3 mm package but is also available in a 2x2 mm package.
The ASIC is first grown on the bottom, then the MEMS mechanical elements are fabricated above and connected with tiny 3 micron vias after which the MEMS element is hermetically sealed with a silicon cap.
MEMS microphones are finding all sorts of sophisticated applications--from noise canceling and beam forming to locating your fingers in 3-D for mid-air gesture recognition: R. Colin Johnson @NextGenLog
Infineon only makes microphone die, but they well over 1 billion per year to MEMS microphone makers.
STMicroelectronics made every part of this tiny bottom ported MEMS microphone except the diaphragm it sourced from Omron.
Hybrid Memory Cubes are 3-D stacks of DRAM that can supercharge a processor--here the 3 teraFLOPS Intel Xeon Phi--by surrounding it with fast-access memory almost without limits.
Micron's 2-gigabyte and 4-gigabyte parts will help customers increase channel bandwidth to 120 and 160 gigabytes per second, respectively. For Intel, Micron is customizing a 16-gigabyte part to supply channels optimized to the massively parallel processors on the next-generation Knights Landing Xeon Phi.
Micron has been working with Intel for several years to optimize the interface channels to maximize bandwidth to its processors. At the 2011 Intel Developers Conference, it demonstrated a single interface channel with a bandwidth of more than 1 terabit per second (seven times greater than DDR3). It also claimed the lowest-ever energy consumption of approximately 8 picoJoules per bit.
With Intel's 3-teraflop next-gen Xeon Phi its market share in supercomputers could soar from 85% to 90% or more, especially with Micron's 3-D memory marvel inside the package for handling Big Data: R. Colin Johnson @NextGanLog
Intel predicts that high-performance computers will grow at a rate of 20% per year as prices drop, inducing more segments to purchase them.
Intel's next-generation Xeon Phi will top 3 teraflops by using the Silvermont architecture, on-package integrated silicon photonics fabric, and 3D hybrid memory cubes jointly developed with Micron.
If they work as well as advertised, these conductive polymers will not only obsolete ITO for displays, but have many other consumer and industrial uses-. Transparent windshield defoggers is just the beginning: R. Colin Johnson
Silver web of self-assembling nanowirrd on flexible, transparent substrate beats ITO by 10X.
Those tiny batteries batteries in wearables could last up to twice as long by adopting a higher precision realtime clock. The trick? Software that wakes up the device to check on Bluetooth, WiFi, button clicks and other inputs doesn't have to build in buffer times to compensate for the inaccuracy of most realtime clocks: R. Colin Johnson @NextGenLog
SiTimes super accurate temperature compensated MEMS oscillator (TCXO) helps extend battery life of wearables by allowing smaller sampling windows for sensors, Bluetooth, WiFi, et. al.
SiTime's temperature controlled MEMS oscillator (TCXO) uses a unique 3-D chip stack with the tiny 125 micron thick MEMS die flipped and mounted between the solder bumps on the bottom of the application specific integrated circuit (ASIC) containing the electronics.
Spintronics can now be simulated on the same SPICE tools already in every engineers toolbox, greatly accelerating the transition to magnetic spin instead of electrical charge as the coin of logic:R. Colin Johnson @NextGenLog
In field-effect devices, the absence or presence of charge is the state variable, but in spintronics electron spin is the state variable.
The differential equations of pin diffusion in a non-magnetic channel (left) can be represented by R-L-C components that can be simulated by SPICE (right).
Cognitive computers—cognizers—aim to instill human-like intelligence into our smartphones, tablets and other electronic devices using microchips that emulate the human brain. Dubbed the “Future of Computing” by the NYTimes, one of the “Best Innovation Moments of 2011” by the Washington Post and one of “10 World Changing Ideas” in a Scientific American cover story “A Computer Chip that Thinks” this book reveals how neuroscience and computer science are merging in a new era of intelligent machines light-years beyond Apple's Siri, IBM's Watson.
Next-generation electronics and technology news stories published non-stop for 20+ years, R. Colin Johnson's unique perspective has prompted coverage of his articles in a diverse range of major media outlets--from the ultra-liberal National Public Radio (NPR) to the ultra-conservative Rush Limbaugh Show.