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Friday, April 17, 2009

"CHIPS: TriQuint retains GaAs foundry lead"


TriQuint Semiconductor Inc. said it remains the largest commercial GaAs foundry based largely on continued growth in communications markets like smartphones.The company recently provided a tour of its Hillsboro, Ore., gallium arsenide foundry TriQuint's industry lead will be reaffirmed next week by industry watcher Strategy Analytics Inc. (Newton, Mass.). TriQuint's first quarter earnings are expected to be down compared to its 21 percent growth in 2008, but it will predict overall growth for 2009. Over 85 percent of TriQuint's sales are standard RF chips for wireless communications. The remainder--about 10 percent commercial and 5 percent for the military--bring its foundry business to about $400 million annually.
Video: http://link.brightcove.com/services/player/bcpid19921014001?bctid=20002883001
Text: http://www.eetimes.com/showArticle.jhtml?articleID=216600188

Wednesday, April 15, 2009

"MEMS: Tronics reports 2008 revenue growth"


MEMS maker Tronics Microsystems SA is reporting a 5 percent increase in revenues for 2008 compared to the previous year despite declining sales in key markets like aerospace. Tronics (Crolles, France), which focuses on custom design services backed by in-house manufacturing of its MEMS chips, said that its net profit totaled 8 percent of revenue for 2008, down from 12 percent in 2007. Tronics 2008 revenue totaled $16.3 million, compared to $15.4 million in 2007, for a net profit of $1.3 million in 2008 compared to $1.9 million the previous year. Tronics said its balance sheet includes $6.6 million in cash and a debt/equity ratio below 30 percent.

BOTTOM LINE: Tronics grew despite 2008 capital expenditures used to finance its U.S. subsidiary, Tronics MEMS Inc. which has a new Dallas-based fab, and its acquisition of MedTech Development (Sunnyvale, Calif.) The company has a strong position for weathering the recession and expects to at least break even in 2009, and return to double-digit growth in 2010.

Text: http://www.eetimes.com/showArticle.jhtml?articleID=216500702

Tuesday, April 14, 2009

"3D: Philips exits 3-D TV market"


Philips Electronics said it will shut down its 3-D Solutions operation which had been readying an autostereoscopic display designed to eliminate the need for special 3-D glasses. The Philips unit had been showing a 42-inch autostereoscopic 3-D display based on a a high-definition (1,920- by 1,080-pixel) LCD panel with a lenticular lens attached. The design eliminated the need for special glasses. Philips said its Consumer Lifestyle TV business will not be affected. That unit will continue to evaluate 3-D TV technology should Philips decide to reenter the market.

BOTTOM LINE: Philips glasses-free 3D display technology had been praised by industry analysts who had seen prototypes. Unfortunatley, the display could only be used for showing 3-D images due to the permanently attached lenticular lens and its 2D-plus-Depth format had little content available. Furthermore the $13,000 price tag for the new displays was too high for consumers. All told Philips decision to shut down its 3-D operation makes sense.

Text: http://www.eetimes.com/showArticle.jhtml?articleID=216500606

Friday, April 10, 2009

"ENERGY: Living organisms triple solar cell efficiency"


By harnessing the shells of living organisms in the sea--microscopic algae called diatoms--engineers have tripled the efficiency of experimental dye-sensitized solar cells. The diatoms were fed a diet of titanium dioxide--the main ingredient for thin film solar cells--instead of their usual meal which is silica (silicon dioxide). As a result, their shells became photovoltaic when coated with dyes. The resulting dye sensitize solar cells were three times more efficient than those without the diatoms.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=216500176

Wednesday, April 08, 2009

"MATERIALS: Graphene stamp manufacturers carbon transistors"


Atomically thin layers of pure carbon atoms in a perfect crystalline lattice--graphene--have vastly greater electron mobility than silicon or gallium arsenide. Unfortunately, graphene is very difficult to grow in uniform sheets. To the rescue is a Ohio State University method, currently being patented, which has the advantage of enabling cheap available bulk crystals of graphite to be patterned into intricate graphene circuitry which can be placed atop a conventional silicon chip. A reusable graphene template patterns all of a chip's carbon-transistor circuitry using in a single micro-contact stamping operation.

"Basically the idea is to stamp layers of graphene in arbitrary shapes on silicon substrates," said Ohio State professor Nitin Padture. " Stamps can be patterned for large areas with dots, squares, lines, whatever shape you need--and can be used over and over, making it a good candidate for production environments."

To prove the concept, Padture's group used conventional photolithography techniques to pattern graphene stamps made from highly-oriented pyrolytic graphite bulk crystals. Each stamp measured three-by-three millimeter square and used about a one millimeter thickness of layered graphene. Since each use of the stamp only deposits a few layers of graphene--some less than a four nanometers thick--it could be reused to stamp out the same graphene circuitry atop millions of silicon chips.

For their tests, the researchers stamped square shapes onto a 300 nanometer layer of insulating silicon dioxide atop a conventional silicon wafer. Because of the strong van der Waal force between graphene and silicon dioxide, the graphite stamp deposited just a few monolayers to the wafer with each application.

Padture's group hopes to gain control of how many layers graphene get deposited with each stamping--eventually permitting consistent deposition of atomically thin monolayers--by adjusting the force of adhesion to the graphite block with custom material mixes for the subtrate.

Using a stamp in the shape of a field of square pillars--each about five microns square--Padture's group was able to depost an array of graphene channels which they are currently characterizing for their electrical characteristics when used for field-effect transistors (FETs).

"We are attaching electrodes to each corner of the graphene squares and are just beginning to test them," said Padture. "Our circuit will demonstrate using the material to make FETs."

Padture, who is also director of Ohio State's Center for Emergent Materials, performed the work with professor Wolfgang Windl and postdoctoral researcher Dongsheng Li. Funding was provided by the Ohio State's Institute for Materials Research as well as by the National Science Foundation (NSF) sponsored Center for Emergent Materials--one of 27 NSF-sponsored Materials Research Science & Engineering Centers (MRSECs) nationwide.

Tuesday, April 07, 2009

"CHIPS: IBM Fellow: Moore's Law defunct"


An IBM researcher says Moore's Law is running out of gas. IBM Fellow Carl Anderson, who oversees physical design and tools in its server division, predicted during the recent International Symposium on Physical Design 2009 conference the end of continued exponential scaling down of the size and cost of semiconductors. The end of the era of Moore's Law, Anderson declared, is at hand. The IBM Fellow observed that like the railroad, automotive and aviation industries before it, the semiconductor industry has matured to the point that the pace of continued innovation is slowing. Anderson was one of 65 semiconductor gurus speaking at the conference, which also unveiled a new method for synthesizing critical paths, a host of analog design innovations and a new twist on the annual physical design contest.

BOTTOM LINE: The continued breakneck pace of semiconductor scaling that has resulted in smaller, cheaper chips cannot continue much longer, due to increasingly high cost of building new fabs. Also, most applications do not require that absolute latest, greatest semiconductor design innovations. Semiconductors will continue to be the driving force in consumer electronics, but increasingly the focus will be on functionality rather than the higher speed and smaller size of the chips used to realize an application.

Text: http://www.eetimes.com/showArticle.jhtml?articleID=216403284

Monday, April 06, 2009

"WIRELESS: Spec-compliant RF remote controls emerge"


The first RF remote controls adhering to the emerging Radio Frequencies for Consumer Electronics (RF4CE) standard were demonstrated at the cable industry's annual show. Remote control maker SMK Electronics Corp. (Tokyo) showed its RF4CE-compliant remote controls using technology provided by Freescale Semiconductor (Austin, Texas). Freescale joined the RF4CE consortium earlier this month, providing momentum to the emerging standard. Other member companies include Panasonic, Philips, Samsung, Sony, OKI and Texas Instruments. During the cable show, SMK demonstrated a remote control with a display that could wirelessly download playlists from an iPod and display them on a TV. The same remote control was also used to control lighting in the room.

BOTTOM LINE: Infrared remote controls are a thing of the past. With the backing of nearly all the world's major consumer electronics makers for standard interoperability, plus the superior performance of RF remote controls, look for infrared remotes to be obsolete within three years.

Text: http://www.eetimes.com/showArticle.jhtml?articleID=216402944

Thursday, April 02, 2009

"ENERGY: MIT harnesses viruses to print 'green' batteries"


Viruses can be used to assemble tiny batteries that can then be printed on plastic films, Massachusetts Institute of Technology researchers claim. The MIT investigators reported on genetically-engineered viruses that were used to self-assemble nanoscale lithium-ion battery materials. The resulting batteries were then printed onto plastic films using green processes. MIT researchers claimed to have perfected the last major component of its flexible battery film, demonstrating performance comparable to existing lithium-ion batteries that run everything from laptop computers to hybrid automobiles. The team is currently optimizing its materials to boost performance beyond existing lithium-ion batteries. Eventually, they plan to commercialize the printable battery films.

BOTTOM LINE: MIT has cleared the final hurdle toward superior thin-film battery technologies self-assembled at the nanoscale with living viruses. With different genetically engineered viruses for patterning both anode- and cathode-electrodes, MIT now has the technology to mass produce flexible, thin-film batteries using a micro-contact technique. Look for conformable batteries using its technology in two to three years.

Text: http://www.eetimes.com/showArticle.jhtml?articleID=216402519