"CHIPS: Polymer slims wafer-level chip-scale packages"

Tessera Technologies Inc. (San Jose, Calif.) announced today (Dec. 11) what it says is one of the slimmest surface-mountable wafer-level chip-scale packages (WLCSPs) available for camera modules, microelectromechanical systems (MEMS) and optical detectors. The Shellcase Razor Thin (RT) package uses a thin polymer on one side, instead of the previous two-sided, glass sandwich, to decrease the package profile to 0.5 millimeter from the 0.9 mm of the previous Shellcase package. The RT version also sheds heat more easily than its predecessor, is insensitive to moisture and is more rugged overall, making it suitable for automotive, aerospace and military applications as well as consumer electronics, according to Tessera.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=196603121