"NANOTECH: for flip-chips blows hot and cold"

Nextreme Inc. (Research Triangle Park, N.C.) claims to have solved the over-heating problem with modern flip-chips with its thermal copper pillar bumps. The technology embeds a thermoelectric cooler into each bump, which can either help cool chips, or can be used in reverse to generate energy from waste heat.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=202400537