The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips. Founding members of the Alliance, Tezzaron Semiconductor Corp. (Naperville, Ill.) and Ziptronix, Inc. (Morrisville, N.C.), are already fabricating memory chips using the IMIS port, the first versions of which will be available by the end of 2008.
Text: http://www.eetimes.com/showArticle.jhtml?articleID=208808499
