Qualcomm has announced the world's first chip set to support both 3G and 4G standards by incorporating dual-carrier HSPA+ and multi-mode 3G/4G Long Term Evolution (LTE) standards into its MDM9200. According to Qualcomm, dual-carrier HSPA+ and LTE deliver more advanced data capabilities to mobile devices that a wide variety of network operators, infrastructure vendors and mobile device manufacturers are planning to deploy worldwide, with multiple field trials scheduled for the first half of next year, with ommercial launches of end-user devices during the second half of 2010.
Text: http://www.prnewswire.com/news-releases/qualcomm-now-sampling-industrys-first-dual-carrier-hspa-and-multi-mode-3glte-chipsets-for-global-markets-69841892.html
