Next generation trends in the physical fabrication of semiconductors, including 3-D and maskless lithography, were recently laid out at this year's 20th annual International Symposium on Physical Design (ISPD 201) in Santa Barbara, Calif., sponsored by the Association for Computing Machinery.
Processors can attain the terascale, according to Intel Labs, by stacking processors with on-chip mesh connectivity on top of memory chips inside the same package. Source: Intel.
New this year is an annual award to honor the past contributions of the movers and shakers in physical design of advanced semicondutors. Further Reading: http://bit.ly/NextGenLog-fFze