Friday, June 06, 2008
Here I review the week's tops stories as compiled from interviews I do for EETimes. This week our top stories include how to water cool 3D chip stacks, how a foundry is offering nanotube-chip fabrication, how quantum measurements could cool chips, how Dolby Volume levels consumer devices, and how Taiwan is set to go WiMAX. Also get a summary of this week's MEMS Ahead blog and a sneak preview of this weekend's Bourne report.
Posted by R. Colin Johnson at 8:08 AM