OmniVision pioneered back-side illumination for commercial imagers--whereby light enters the backside of the chip through a window to directly shine on photodetectors--and has now introduced its scaled down second generation back-side illumination CMOS imager. Look for other CMOS imager makers to move to back-side illumination in the next few years. R.C.J.
OmniVision Technologies, Inc. will show its second-generation back-side illuminated CMOS imaging chip to OEMs during next week's Mobile World Congress (Barcelona, Spain Feb. 15-18, 2010). OmniVision (Santa Clara, Calif.) uses a novel backside illumination technique in which photodetectors are fabricated at the bottom of the chip stack situated on a transparent window. After fabricating metal interconnection layers, the chip is then flipped so that its photodetectors are on top (under the window).
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