Friday, July 20, 2012

#CHIPS: "DOE Awards Intel $19 Million for Exascale by 2020"

Exascale computers 1000-times more powerful than the fastest petascale supercomputers today are needed for a variety of scientific, energy and military applications, according to the Department of Energy (DOE) which has awarded development contracts to AMD, EMC, HDF Group, Nvidia, and Whamcloud. The latest contract--$19 million to Intel--aims to capitalize on its latest massively parallel processors--the Many Integrated Core (MIC) Xeon Phi with over 50 integrated cores per chip: R. Colin Johnson

As the first member of its Many Integrated Core (MIC) architecture, Intel's Xeon Phi coprocessor board makes use of its 22-nanometer 3-D Tri-gate transistors. Source: Intel

The Department of Energy (DOE) announced a $19 million award to Intel Federal to develop exascale processors, next-generation memories, and ultra-fast input/output (I/O) technologies for Lawrence Livermore National Security’s (LLNS’s) Extreme-Scale Computing Research and Development “FastForward” program.

By enlisting broad cooperative contributions from industry, academia, and other national laboratories, DOE’s LLNS aims to develop all the necessary high-performance computing (HPC) capabilities needed to achieve exascale systems by 2020...Intel Federal’s twofold contract will apply the whole range of Intel’s capabilities, from basic research to development to prototyping to systems integration. Besides its MIC architecture and Xeon Phi massively parallel coprocessors, Intel also will enlist its 3-D memory technology developed with Micron Technology, called the Hybrid Memory Cube, as well as its high-speed interconnect technologies acquired earlier this year: Infiniband’s switched fabric network acquired from QLogic, and the Gemini interconnect technology acquired from Cray.
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