#CHIPS: "DARPA: 3-D chips to get cooler"

3-D chips are all the rage in theory, but getting the heat out of the interior layers is a gigantic problem that is slowing down adoptions, according to the Georgia Institute of Technology which just started a three-year $2.9 million effort with Rockwell-Collins to solve the problem. Using cooling technique that pipes liquid coolant between the layers of chips, the the Defense Advanced Research Projects Agency (DARPA) funded project aims to concentrate cooling efforts on hot-spots like processors: R. Colin Johnson @NextGenLog


From left, Muhannad Bakir, Andrei Fedorov, Yogendra Joshi and Suresh Sitaraman at Georgia Tech are developing 3-D chip cooling technologies. (Photo: Gary Meek)
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