#MEMS: "Silex / BroadPak Team on 3-D Chip Stacks"

All chip makers agree that three-dimensional (3-D) stacks will be necessary in the near future--that is if some way can be found to remove the heat from the inner layers. In the mean time, Silex Microsystems--a MEMS foundry--and BroadPak--a 3-D integrator--are collaborated on 2.5-D silicon interposer solutions that combine MEMS and CMOS as an interim solution with true 3-D chip stacks still just around the corner: R. Colin Johnson @NextGenLog

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