All Sensors Corp. (Morgan Hill, Calif.) uses a proprietary Collinear Beam technology that it claims yields an ultra low pressure sensor for high volume applications requiring pressure measurement to as low as a quarter inch of water full scale. The MEMS Piezoresistive Low Pressure Sensing Die utilizes an open bridge configuration while measuring just 2mm x 2mm square, and achieves the industry's best sensitivity specifications, according to All Sensors, by virtue of its innovative MEMS topology. Look for low-pressure apps to begin switching to MEMS sensors over the next few years. R.C.J.
Here is what All Sensors says about its new MEMS sensor: The All Sensors’ pressure sensor die uses a proprietary Collinear Beam technology registered as COBEAM2 ™. This technology advances the state of the art for piezoresis- tive pressure sensors beyond what has been achievable for low pressure sensing using silicon based longitudinal and transverse strain technology. The technology achieves a high level of pressure sensitivity previously requiring boss structures and larger die to- pologies. By eliminating the more typical boss structure in the design both gravity and vibration sensitivity are signifi cantly reduced. The strain sensitive resistors are processed to allow either constant current or voltage excitation through selection of temperature coeffi cients of resistance and sensitivity. The COBEAM2 ™ technology embodies aspects of 1950’s bonded strain gage sensors with state of the art MEMS processing of six inch silicon wafers.
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