Audio chip growth at 300 million today at Tensilica is predicted to top 1 billion by 2014, with total market growing to 10 billion by 2016. Source: Tensilica
Tensilica Inc. (Santa Clara, Calif.) is banking its future growth on the world's largest electronics market by adding support for China's Dynamic Resolution Adaptation (DRA) standard to its entire library of over 100 audio encoders, decoders, an sound enhancement chips for adding high-fidelity audio digital signal processors (DSPs) to mobile handsets.
Tesilica predicts it will top the billion unit mark in shipments of its high-fidelity DSP audio chips into mobile phone market by 2014, up from 300 million units today. Tensilica's software partners to address this market include Dolby, Acoustic Technologies, DTS, SRS, QSound, Sensor, Audyssey, AM3D and Arkamys.