Here is what EV Group says about its own efforts at Semicon West: EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced it has received an order for its EVG520IS semi-automated wafer bonding system and EVG620TB mask and bond aligner from the University of Texas at Arlington (UTA). The tools will be employed at Nano Fab - UTA's Nanotechnology Research and Teaching Facility, which is funded by the National Science Foundation's Major Research Instrumentation Program - for a wide range of MEMS-related as well as photonics and optoelectronics research. The order is EVG's latest centered on the MEMS market, following its March shipment of two wafer bonders to the University of Michigan's Lurie Nanofabrication Facility for advanced MEMS research. MEMS are currently undergoing explosive growth, according to market analyst firm Yole Developpement, outpacing nearly every other segment of the electronics industry due to their implementation in sensors and accelerometers for mobile handsets, set-top boxes, gaming consoles and other high-volume consumer applications. A long-established premier provider of wafer bonding, alignment and handling equipment to MEMS-focused customers in industry as well as academia - 27 of the world's top 30 MEMS manufacturers use its equipment - EVG has leveraged its success in this arena to migrate into key emerging technologies, including 3D ICs and light-emitting diodes (LEDs)...
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